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المؤلفون: Pietro Babighian, Muhammed Pallachali, Nicolai Petrov, Tamer Desouky, Teck Jung Tang, Fadi Batarseh, Deborah Ryan, Shweta Shokale, Mark Terry, Haizhou Yin, Rohan Deshpande, Jiechang Hou, Yixiao Zhang, Sang-Kee Eah, Rao Desineni, Feng Wang, Ahmed Khalil
المصدر: Photomask Technology.
مصطلحات موضوعية: Engineering, Engineering drawing, Yield (engineering), Silicon, business.industry, chemistry.chemical_element, Edge (geometry), chemistry, Electronic engineering, Process control, Process window, Upstream (networking), Wafer, business, Aerial image
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::379ffba485daca644e6c71206a0b34f3
https://doi.org/10.1117/12.2280568 -
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المؤلفون: Atul Chittora, John Carulli, Yan Pan, Sherwin Fernandes, Rao Desineni, Neerja Bawaskar, Kannan Sekar
المصدر: ITC
مصطلحات موضوعية: Engineering, Engineering drawing, business.industry, Manufacturing process, Volume (computing), 02 engineering and technology, 01 natural sciences, 020202 computer hardware & architecture, 010309 optics, Identification (information), Software, 0103 physical sciences, 0202 electrical engineering, electronic engineering, information engineering, Systems engineering, Pylon, business
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::3dfd8b0119223fde12e2594e6bfab153
https://doi.org/10.1109/test.2016.7805872 -
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المؤلفون: Rao Desineni, Yan Pan
المصدر: EDFA Technical Articles. 19:62-63
مصطلحات موضوعية: Electrical and Electronic Engineering, Safety, Risk, Reliability and Quality
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::4d7098c6c5c42dd1e83eaab3733c22bb
https://doi.org/10.31399/asm.edfa.2017-4.p062 -
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المؤلفون: Shobhit Malik, C. Schuermyer, Thomas Herrmann, Rao Desineni, Geir Eide, Sriram Madhavan
المصدر: IEEE Design & Test. 30:26-34
مصطلحات موضوعية: Identification (information), Hardware and Architecture, Feature (computer vision), business.industry, Computer science, Real-time computing, Pattern recognition, Artificial intelligence, Electrical and Electronic Engineering, business, Software, Software quality, Volume (compression)
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المؤلفون: Venkatesan Muthumalai, Rao Desineni, Nancy Bell, Ritesh Turakhia, Thomas Berndt, Aaron Sinnott, David Iverson
المصدر: 25th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2014).
مصطلحات موضوعية: Engineering, Hardware_MEMORYSTRUCTURES, Yield (engineering), business.industry, Process development, Volume (computing), Hardware_PERFORMANCEANDRELIABILITY, Integrated circuit, law.invention, Reliability engineering, law, Product (mathematics), Hardware_INTEGRATEDCIRCUITS, Electronic engineering, Static random-access memory, business, Electronic circuit
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::a203b00c84db5bda437ceb26e9e77349
https://doi.org/10.1109/asmc.2014.6846945 -
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المؤلفون: Thomas Berndt, Sagar A. Kekare, Yan Pan, Goh Szu Huat, John Kim, Edward Kah Ching Teoh, Rao Desineni, Jane Lambert, Victor Lim
المصدر: ASMC 2013 SEMI Advanced Semiconductor Manufacturing Conference.
مصطلحات موضوعية: Engineering, business.industry, law, Hardware_PERFORMANCEANDRELIABILITY, Integrated circuit design, Integrated circuit, Process simulation, business, law.invention, Reliability engineering
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::3ff9fef882678cdfe703e2c6d34279eb
https://doi.org/10.1109/asmc.2013.6552805 -
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المؤلفون: Luigi Capodieci, Vito Dai, Sarah McGowan, Rao Desineni, Kok Peng Chua, Sky Yeo, Carl P. Babcock, Akif Sultan, Eswar Ramanathan, Colin Hui, Robert Madge, Kristina Hoeppner, Jens Hassmann, Edward Kah Ching Teoh
المصدر: ASMC 2013 SEMI Advanced Semiconductor Manufacturing Conference.
مصطلحات موضوعية: Engineering, Product lifecycle, Product life-cycle management, business.industry, Yield (finance), Suite, Systems engineering, business, Integrated circuit layout, Manufacturing engineering, Design for manufacturability
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::9d43bad0f5e6070b5fa38e100ca6e371
https://doi.org/10.1109/asmc.2013.6552799