المؤلفون: Kumar, V., Rao V., S., Jain, P.K.

المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 70(3):1288-1293 Mar, 2023

المؤلفون: Kalpana Upadhyaya, Venkatesh Gude, Golam Mohiuddin, Rao V. S. Nandiraju

المصدر: Beilstein Journal of Organic Chemistry, Vol 9, Iss 1, Pp 26-35 (2013)

مصطلحات موضوعية: bent-core mesogens, cyanobiphenyl, dipole moment, liquid crystals, nematic phase, polarity, Science, Organic chemistry, QD241-441

وصف الملف: electronic resource

Relation: https://doaj.org/toc/1860-5397

URL الوصول: https://doaj.org/article/12530cc278da4df9b741e989c45eb378

المؤلفون: Deb, Rahul, Nath, Rahul Kanti, Sarkar, Dipika Debnath, Mohiuddin, Golam, Nandiraju, Rao V S, Aya, Satoshi, Van Le, Khoa, Araoka, Fumito, Ishikawa, Ken, Takezoe, Hideo, Takanishi, Yoichi

المصدر: In Journal of Molecular Structure 5 December 2024 1317

المؤلفون: Rao, V S Venkateshwara, Krishna, N Phani, Abhilash, G, Nithya, M.

المصدر: 2015 IEEE 9th International Conference on Intelligent Systems and Control (ISCO) Intelligent Systems and Control (ISCO), 2015 IEEE 9th International Conference on. :1-4 Jan, 2015

Relation: 2015 IEEE 9th International Conference on Intelligent Systems and Control (ISCO)

المؤلفون: Debbarma, D., Wang, Q., Lo, A., de Groot, S. M. Heemstra, Prasad, R. Venkatesha, Rao, V. S.

المصدر: Eurocon 2013 EUROCON, 2013 IEEE. :494-501 Jul, 2013

Relation: IEEE EUROCON 2013

المؤلفون: Sekhar, V. N., Rao, V. S., Sharma, Gaurav, Rajoo, Ranjan, Serene Thew Mei Ling, Khong Chee Houe, Chong Ser Choong, Cheng Cheng Kuo

المصدر: 2010 12th Electronics Packaging Technology Conference Electronics Packaging Technology Conference (EPTC), 2010 12th. :668-672 Dec, 2010

Relation: 2010 12th Electronics Packaging Technology Conference - (EPTC 2010)

المؤلفون: Pei-Siang, S. L., Che, F. X., Choong, C. S., Rong, M. C. B., Sekhar, V. N., Rao, V. S., Chong, C. T.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 3(11):1960-1970 Nov, 2013

المؤلفون: Chong, S. C., Wee, D. H. S., Rao, V. S., Vasarla, N. S.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 3(10):1654-1662 Oct, 2013

المؤلفون: Rao, V. S. H., Kumar, M. N.

المصدر: IEEE Journal of Biomedical and Health Informatics IEEE J. Biomed. Health Inform. Biomedical and Health Informatics, IEEE Journal of. 17(1):183-189 Jan, 2013

المؤلفون: Zhang, X., Rajoo, R., Selvanayagam, C. S., Kumar, A., Rao, V. S., Khan, N., Kripesh, V., Lau, J. H., Kwong, D.-L., Sundaram, V., Tummala, R. R.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 2(6):935-943 Jun, 2012