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1مؤتمر
المؤلفون: Yin, Baiqing, Han, Rulei, Guo, Kai, Wang, Yuqiang, Gao, Likai, Li, Chushan
المصدر: 2023 IEEE 2nd International Power Electronics and Application Symposium (PEAS) Power Electronics and Application Symposium (PEAS), 2023 IEEE 2nd International. :2569-2573 Nov, 2023
Relation: 2023 IEEE 2nd International Power Electronics and Application Symposium (PEAS)
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2مؤتمر
المؤلفون: Wang, Shenghao, Jia, Wenhao, Guo, Honglei, Chen, Shuai
المصدر: 2022 International Conference on Manufacturing, Industrial Automation and Electronics (ICMIAE) ICMIAE Manufacturing, Industrial Automation and Electronics (ICMIAE), 2022 International Conference on. :74-78 Aug, 2022
Relation: 2022 International Conference on Manufacturing, Industrial Automation and Electronics (ICMIAE)
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3مؤتمر
المؤلفون: Bhattarai, Suyesh, Vichare, Parag, Dahal, Keshav, Ghimire, Subodh Kumar, Raju, D. Krishna Mohan
المصدر: 2017 11th International Conference on Software, Knowledge, Information Management and Applications (SKIMA) Software, Knowledge, Information Management and Applications (SKIMA), 2017 11th International Conference on. :1-6 Dec, 2017
Relation: 2017 11th International Conference on Software, Knowledge, Information Management and Applications (SKIMA)
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4كتاب إلكتروني
المؤلفون: Babu, ShyamAff13, Vishwakarma, Devendra KumarAff14, Sharma, SumitAff15
المساهمون: Cavas-Martínez, Francisco, Series EditorAff1, Chaari, Fakher, Series EditorAff2, di Mare, Francesca, Series EditorAff3, Gherardini, Francesco, Series EditorAff4, Haddar, Mohamed, Series EditorAff5, Ivanov, Vitalii, Series EditorAff6, Kwon, Young W., Series EditorAff7, Trojanowska, Justyna, Series EditorAff8, Vashista, Meghanshu, editorAff9, Manik, Gaurav, editorAff10, Verma, Om Prakash, editorAff11, Bhardwaj, Bhuvnesh, editorAff12
المصدر: Recent Innovations in Mechanical Engineering : Select Proceedings of ICRITDME 2020. :181-189
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5دورية أكاديمية
لا يتم عرض هذه النتيجة على الضيوف.
تسجيل الدخول للوصول الكامل. -
6دورية أكاديمية
المؤلفون: Md Wasi Uddin, Najmus Saquib Sifat
المصدر: International Journal of Thermofluids, Vol 17, Iss , Pp 100296- (2023)
مصطلحات موضوعية: Minichannel, Heat sink, Rectangular fin, Rounded end, Oblique fin, Secondary channel, Heat, QC251-338.5
وصف الملف: electronic resource
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7دورية أكاديمية
المؤلفون: Xiaoyan Wu, Yixiang Huang, Xu Zhang
المصدر: Case Studies in Thermal Engineering, Vol 42, Iss , Pp 102758- (2023)
مصطلحات موضوعية: Thermal contact resistance, Dimensionless fin efficiency, Dimensionless overall surface efficiency, Rectangular fin, Passive nuclear plant, Engineering (General). Civil engineering (General), TA1-2040
وصف الملف: electronic resource
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8مؤتمر
المؤلفون: Wu, Kehuey, Ding, Wei-Wen, Chiang, Meng-Hsueh
المصدر: 2013 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) Simulation of Semiconductor Processes and Devices (SISPAD), 2013 International Conference on. :143-146 Sep, 2013
Relation: 2013 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)
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9دورية أكاديمية
لا يتم عرض هذه النتيجة على الضيوف.
تسجيل الدخول للوصول الكامل. -
10دورية أكاديمية
المؤلفون: M., Turkyilmazoglu
المصدر: International Journal of Numerical Methods for Heat & Fluid Flow, 2020, Vol. 31, Issue 4, pp. 1057-1068.