المؤلفون: Yin, Baiqing, Han, Rulei, Guo, Kai, Wang, Yuqiang, Gao, Likai, Li, Chushan

المصدر: 2023 IEEE 2nd International Power Electronics and Application Symposium (PEAS) Power Electronics and Application Symposium (PEAS), 2023 IEEE 2nd International. :2569-2573 Nov, 2023

Relation: 2023 IEEE 2nd International Power Electronics and Application Symposium (PEAS)

المؤلفون: Wang, Shenghao, Jia, Wenhao, Guo, Honglei, Chen, Shuai

المصدر: 2022 International Conference on Manufacturing, Industrial Automation and Electronics (ICMIAE) ICMIAE Manufacturing, Industrial Automation and Electronics (ICMIAE), 2022 International Conference on. :74-78 Aug, 2022

Relation: 2022 International Conference on Manufacturing, Industrial Automation and Electronics (ICMIAE)

المؤلفون: Bhattarai, Suyesh, Vichare, Parag, Dahal, Keshav, Ghimire, Subodh Kumar, Raju, D. Krishna Mohan

المصدر: 2017 11th International Conference on Software, Knowledge, Information Management and Applications (SKIMA) Software, Knowledge, Information Management and Applications (SKIMA), 2017 11th International Conference on. :1-6 Dec, 2017

Relation: 2017 11th International Conference on Software, Knowledge, Information Management and Applications (SKIMA)

المؤلفون: Babu, Shyam^Aff13, Vishwakarma, Devendra Kumar^Aff14, Sharma, Sumit^Aff15

المساهمون: Cavas-Martínez, Francisco, Series Editor^Aff1, Chaari, Fakher, Series Editor^Aff2, di Mare, Francesca, Series Editor^Aff3, Gherardini, Francesco, Series Editor^Aff4, Haddar, Mohamed, Series Editor^Aff5, Ivanov, Vitalii, Series Editor^Aff6, Kwon, Young W., Series Editor^Aff7, Trojanowska, Justyna, Series Editor^Aff8, Vashista, Meghanshu, editor^Aff9, Manik, Gaurav, editor^Aff10, Verma, Om Prakash, editor^Aff11, Bhardwaj, Bhuvnesh, editor^Aff12

المصدر: Recent Innovations in Mechanical Engineering : Select Proceedings of ICRITDME 2020. :181-189

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المؤلفون: Md Wasi Uddin, Najmus Saquib Sifat

المصدر: International Journal of Thermofluids, Vol 17, Iss , Pp 100296- (2023)

مصطلحات موضوعية: Minichannel, Heat sink, Rectangular fin, Rounded end, Oblique fin, Secondary channel, Heat, QC251-338.5

وصف الملف: electronic resource

Relation: http://www.sciencedirect.com/science/article/pii/S2666202723000174; https://doaj.org/toc/2666-2027

URL الوصول: https://doaj.org/article/6cdd0fc10cba48abb27898a4b1d81e99

المؤلفون: Xiaoyan Wu, Yixiang Huang, Xu Zhang

المصدر: Case Studies in Thermal Engineering, Vol 42, Iss , Pp 102758- (2023)

مصطلحات موضوعية: Thermal contact resistance, Dimensionless fin efficiency, Dimensionless overall surface efficiency, Rectangular fin, Passive nuclear plant, Engineering (General). Civil engineering (General), TA1-2040

وصف الملف: electronic resource

Relation: http://www.sciencedirect.com/science/article/pii/S2214157X23000643; https://doaj.org/toc/2214-157X

URL الوصول: https://doaj.org/article/24c13045e8a04d18a35a7ad9de3a388d

المؤلفون: Wu, Kehuey, Ding, Wei-Wen, Chiang, Meng-Hsueh

المصدر: 2013 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) Simulation of Semiconductor Processes and Devices (SISPAD), 2013 International Conference on. :143-146 Sep, 2013

Relation: 2013 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)

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المؤلفون: M., Turkyilmazoglu

المصدر: International Journal of Numerical Methods for Heat & Fluid Flow, 2020, Vol. 31, Issue 4, pp. 1057-1068.

URL الوصول: http://www.emeraldinsight.com/doi/10.1108/HFF-02-2020-0099