يعرض 1 - 10 نتائج من 31 نتيجة بحث عن '"Ren, Haoxiang"', وقت الاستعلام: 1.01s تنقيح النتائج
  1. 1
    مؤتمر
    Heterogeneous Power Delivery for Large Chiplet-based Systems using Integrated GaN/Si-Interconnect Fabric with sub-10 μm Bond Pitch

    المؤلفون: Ren, Haoxiang, Sahoo, Krutikesh, Guo, Ziyi, Pugazhendhi, Rishi, Wong, Zachary, Xiang, Tianyu, Fisher, Timothy S., Iyer, Subramanian S.

    المصدر: 2023 International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2023 International. :1-4 Dec, 2023

    Relation: 2023 International Electron Devices Meeting (IEDM)

    Full Text Finder
    أضف إلى المفضلة
  2. 2
    مؤتمر
    3D flexible Fan-Out Wafer-Level Packaging for Wearable Devices

    المؤلفون: Ouyang, Guangqi, Fukushima, Takafumi, Ren, Haoxiang, Iyer, Subramanian S.

    المصدر: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :601-605 May, 2023

    Relation: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)

    Full Text Finder
    أضف إلى المفضلة
  3. 3
    مؤتمر
    A High Throughput Two-Stage Die-to-Wafer Thermal Compression Bonding Scheme for Heterogeneous Integration

    المؤلفون: Sahoo, Krutikesh, Ren, Haoxiang, Iyer, Subramanian S.

    المصدر: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :362-366 May, 2023

    Relation: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)

    Full Text Finder
    أضف إلى المفضلة
  4. 4
    مؤتمر
    Large Wafer GaN on Silicon Reconstitution with Gold-to-Gold Thermocompression Bonding

    المؤلفون: Kuchhangi, Ankit, Ren, Haoxiang, Sahoo, Krutikesh, Iyer, Subramanian S.

    المصدر: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :1633-1637 May, 2023

    Relation: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)

    Full Text Finder
    أضف إلى المفضلة
  5. 5
    مؤتمر
    Demonstration of a Power-efficient and Cost-effective Power Delivery Architecture for Heterogeneously Integrated Wafer-scale Systems

    المؤلفون: Ren, Haoxiang, Sahoo, Krutikesh, Xiang, Tianyu, Ouyang, Guangqi, Iyer, Subramanian S.

    المصدر: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :1614-1621 May, 2023

    Relation: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)

    Full Text Finder
    أضف إلى المفضلة
  6. 6
    مؤتمر
    RF Characterization on Nb-based Superconducting Silicon Interconnect Fabric for Future Large Scale Quantum Applications

    المؤلفون: Yang, Yu-Tao, Ren, Haoxiang, Chong, Su Kong, Qiu, Gang, Ku, Shu-Yun, Cheng, Yang, Hu, Chaowei, Qian, Tiema, Chen, Kuan-Neng, Ni, Ni, Wang, Kang L., Iyer, Subramanian S.

    المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :949-955 May, 2022

    Relation: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

    Full Text Finder
    أضف إلى المفضلة
  7. 7
    مؤتمر
    Recess Effect Study and Process Optimization of Sub-10 μm Pitch Die-to-wafer Hybrid Bonding

    المؤلفون: Ren, Haoxiang, Yang, Yu-Tao, Iyer, Subramanian S.

    المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :149-156 May, 2022

    Relation: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

    Full Text Finder
    أضف إلى المفضلة
  8. 8
    مؤتمر
    Fabrication of Flexible Li-ion Battery Electrodes Using "Battlets" Approach with Ionic Liquid Electrolyte for Powering Wearable Devices

    المؤلفون: Ouyang, Guangqi, Whang, Grace, MacInnis, Emily, Ren, Haoxiang, Sun, Henry, Irwin, Randall, Dunn, Bruce, Iyer, Subramanian S.

    المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :780-785 May, 2022

    Relation: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

    Full Text Finder
    أضف إلى المفضلة
  9. 9
    مؤتمر
    A Study on Warpage and Reflow Profile for Extreme Extension of Mass Reflow Bonding

    المؤلفون: Shin, Jiwon, Woo, Kwangbok, Kwon, Donguk, Kim, Youngja, Lee, Youngmin, Kang, Dongwoo, Sahoo, Krutikesh, Ren, Haoxiang, Huang, Yu-Pei, Shah, Ujash, Yang, Yutao, Kuchhangi, Ankit, Iyer, Subramanian S.

    المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :1158-1162 May, 2022

    Relation: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

    Full Text Finder
    أضف إلى المفضلة
  10. 10
    مؤتمر
    TSV-less Power Delivery for Wafer-scale Assemblies and Interposers

    المؤلفون: Ren, Haoxiang, Pal, Saptadeep, Ouyang, Guangqi, Irwin, Randall, Yang, Yu-Tao, Iyer, Subramanian S.

    المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :1934-1939 May, 2022

    Relation: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

    Full Text Finder
    أضف إلى المفضلة
أدوات البحث: أحصل على تغذية RSS – أرسل هذا البحث بالبريد الإلكتروني – حفظ البحث – جدول التنبيهات: لا شيء