يعرض 1 - 10 نتائج من 366 نتيجة بحث عن '"Ren, Qin"', وقت الاستعلام: 1.71s تنقيح النتائج
  1. 1
    مؤتمر
    Multimodal-AIR-BERT: A Multimodal Pre-trained Model for Antigen Specificity Prediction in Adaptive Immune Receptors

    المؤلفون: Xiao, Yang, Huang, Yueshan, Zhao, Yu, Xu, Fan, Ren, Qin, He, Bing, Yao, Jianhua, Liu, Xiao

    المصدر: 2023 IEEE International Conference on Bioinformatics and Biomedicine (BIBM) Bioinformatics and Biomedicine (BIBM), 2023 IEEE International Conference on. :69-75 Dec, 2023

    Relation: 2023 IEEE International Conference on Bioinformatics and Biomedicine (BIBM)

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  2. 2
    مؤتمر
    Wafer Stacked Wide I/O DRAM with One-step TSV Technology

    المؤلفون: Kawano, Masaya, Wang, Xiang-Yu, Ren, Qin, Loh, Woon-Leng, Chandra Rao, B. S. S., Chui, King-Jien, Kawagoe, Tsuyoshi, Homma, Ichiro

    المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :143-148 May, 2022

    Relation: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

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  3. 3
    مؤتمر
    One-step TSV process development for 4-layer wafer stacked DRAM

    المؤلفون: Kawano, Masaya, Wang, Xiang-Yu, Ren, Qin, Loh, Woon-Leng, Rao, BSS. Chandra, Chui, King-Jien

    المصدر: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2021 IEEE 71st. :673-679 Jun, 2021

    Relation: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)

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  4. 4
    مؤتمر
    Wafer Level Fine-Pitch Hybrid Bonding: Challenges and Remedies

    المؤلفون: Chidambaram, Vivek, Leong, Yew Wing, Ren, Qin

    المصدر: 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2020 IEEE 22nd. :459-463 Dec, 2020

    Relation: 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC)

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  5. 5
    مؤتمر
    Temporary Bonding and De-bonding Process for 2.5D/3D Applications

    المؤلفون: Ren, Qin, Loh, Woon Leng, Neo, Siang Kiat, Chui, King-Jien

    المصدر: 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2020 IEEE 22nd. :27-31 Dec, 2020

    Relation: 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC)

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  6. 6
    مؤتمر
    Yield Improvement of Silicon Trench Isolation for One-Step TSV

    المؤلفون: Wang, Xiangyu, Ren, Qin, Kawano, Masaya

    المصدر: 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2020 IEEE 22nd. :22-26 Dec, 2020

    Relation: 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC)

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  7. 7
    مؤتمر
    Trench Isolation Technology for Cost-effective Wafer-level 3D Integration with One-step TSV

    المؤلفون: Kawano, Masaya, Wang, Xiang-Yu, Ren, Qin

    المصدر: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :1161-1166 Jun, 2020

    Relation: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

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  8. 8
    مؤتمر
    A 2-tier Embedded 3D Capacitor with High Aspect Ratio TSV

    المؤلفون: Chui, King-Jien, Wang, I-Ting, Che, Faxing, Chen, Zhixian, Wang, Xiang Yu, Loh, Woon Leng, Ren, Qin, Ji, Lin, Zhu, Yao

    المصدر: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :611-616 Jun, 2020

    Relation: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

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  9. 9
    مؤتمر
    Die-to-wafer Bonding: Comparison of Designing, Processing and Assembling of Different Approaches

    المؤلفون: Xie, Ling, Li, Hongyu, Chong, Ser Choong, Ren, Qin

    المصدر: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2019 IEEE 21st. :382-387 Dec, 2019

    Relation: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC)

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  10. 10
    مؤتمر
    Yield Impacting Defects and Prevention of Microbump Formation

    المؤلفون: Ren, Qin, Li, Hongyu, Kawano, Masaya

    المصدر: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2019 IEEE 21st. :392-395 Dec, 2019

    Relation: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC)

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