المؤلفون: Pellegrini, S., Nicholson, I., Helleboid, R., Mamdy, B., Forcolin, G., Al-Rawhani, M., Buj, C., Marchand, G., Rae, B., Golanski, D., Mugny, G., Bianchi, R. A., Rideau, D.

المصدر: 2023 International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2023 International. :1-4 Dec, 2023

Relation: 2023 International Electron Devices Meeting (IEDM)

المؤلفون: Rideau, D., Uhring, W., Bianchi, R. A., Helleboid, R., Mugny, G., Grebot, J., Manouvrier, J.R., Neri, R., Brun, F., Lakeh, M. Dolatpoor, Rink, S., Kammerer, J-B., Lallement, C., Lacombe, E., Golanski, D., Rae, B., Bah, T. M., Twaddle, F., Quenette, V., Marchand, G., Buj, C., Fillon, R., Henrion, Y., Nicholson, I., Agnew, M., Basset, M., Perrier, R., Al-Rawhani, M., Mamdy, B., Pellegrin, S., Gouget, G., Maciazek, P., Juge, A., Dartigues, A., Alause, H. Wehbe

المصدر: ESSDERC 2023 - IEEE 53rd European Solid-State Device Research Conference (ESSDERC) Solid-State Device Research Conference (ESSDERC), ESSDERC 2023 - IEEE 53rd European. :144-147 Sep, 2023

Relation: ESSDERC 2023 - IEEE 53rd European Solid-State Device Research Conference (ESSDERC)

المؤلفون: Rink, S., Quenette, V., Manouvrier, J.R., Juge, A., Gouget, G., Rideau, D., Bianchi, R.A., Golanski, D., Mamdy, B., Kammerer, J.B., Uhring, W., Lallement, C., Pellegrini, S., Agnew, M., Rae, B.

المصدر: ESSDERC 2022 - IEEE 52nd European Solid-State Device Research Conference (ESSDERC) Solid-State Device Research Conference (ESSDERC), ESSDERC 2022 - IEEE 52nd European. :281-284 Sep, 2022

Relation: ESSDERC 2022 - IEEE 52nd European Solid-State Device Research Conference (ESSDERC)

المؤلفون: Jay, A., Hemeryck, A., Cristiano, F., Rideau, D., Julliard, P.L., Goiffon, V., LeRoch, A., Richard, N., Samos, L. Martin, Gironcoli, S. De

المصدر: 2021 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) Simulation of Semiconductor Processes and Devices (SISPAD), 2021 International Conference on. :128-132 Sep, 2021

Relation: 2021 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)

المؤلفون: Rideau, D., Oussaiti, Y., Grebot, J., Helleboid, R., Lopez, A., Mugny, G., Bourreau, E., Golanski, D., Mamdy, B., Alause, H. Wehbe, Nicholson, I., Pellegrini, S., Vlimant, C.E., Agnew, M., Cazimajou, T., Pala, M., Saint-Martin, J., Dollfus, P.

المصدر: 2021 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) Simulation of Semiconductor Processes and Devices (SISPAD), 2021 International Conference on. :293-296 Sep, 2021

Relation: 2021 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)

المؤلفون: Helleboid, R., Rideau, D., Grebot, J., Nicholson, I., Moussy, N., Saxod, O., Basset, M., Zimmer, A., Mamdy, B., Golanski, D., Agnew, M., Pellegrini, S., Sicre, M., Buj, C., Marchand, G., Saint-Martin, J., Pala, M., Dollfus, P.

المصدر: IEEE Journal of the Electron Devices Society IEEE J. Electron Devices Soc. Electron Devices Society, IEEE Journal of the. 10:584-592 2022

المؤلفون: Julliard, P.L., Dumas, P., Monsieur, F., Hilario, F., Rideau, D., Hemeryck, A., Cristiano, F.

المصدر: 2020 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) Simulation of Semiconductor Processes and Devices (SISPAD), 2020 International Conference o. :43-46 Sep, 2020

Relation: 2020 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)

المؤلفون: oussaiti, Y., Rideau, D., Manouvrier, J.R., Quenette, V., Mamdy, B., Buj, C., Grebot, J., Wehbe-Alause, H., Lopez, A., Mugny, G., Agnew, M., Lacombe, E., Pala, M., Dollfus, P.

المصدر: 2020 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) Simulation of Semiconductor Processes and Devices (SISPAD), 2020 International Conference o. :145-148 Sep, 2020

Relation: 2020 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)

المؤلفون: Vianne, Benjamin, Crocherie, Axel, Guissi, Sofiane, Sieger, Daniel, Calderon, Stephane, Rideau, D., Wehbe-Alause, Helene

المصدر: 2019 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) Simulation of Semiconductor Processes and Devices (SISPAD), 2019 International Conference on. :1-4 Sep, 2019

Relation: 2019 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)

المؤلفون: Cazimajou, T., Pala, M., Saint-Martin, J., Helleboid, R., Grebot, J., Rideau, D., Dollfus, P.

المصدر: IEEE Journal of the Electron Devices Society IEEE J. Electron Devices Soc. Electron Devices Society, IEEE Journal of the. 9:1098-1102 2021