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المؤلفون: Ehrenfried Zschech, Uwe Muehle, Valeriy Sukharev, Armen Kteyan, Martin Gall, Riko Radojcic
المساهمون: Publica
المصدر: IEEE Transactions on Device and Materials Reliability. 17:643-651
مصطلحات موضوعية: Materials science, finite element analysis, 02 engineering and technology, 01 natural sciences, law.invention, Stress (mechanics), MOSFET, law, 0103 physical sciences, through-silicon via, Calibration, Electrical measurements, strain measurement, Integrated circuit packaging, Electrical and Electronic Engineering, Safety, Risk, Reliability and Quality, Parametric statistics, 010302 applied physics, business.industry, Transistor, Structural engineering, 021001 nanoscience & nanotechnology, Finite element method, Electronic, Optical and Magnetic Materials, Electrical network, 0210 nano-technology, business
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المؤلفون: Riko Radojcic, Karthikeyan Dhandapani, Ahmer Syed, Ron Lindley, Wei Zhao, Mark Schwarz, Mark Nakamoto, Vidhya Ramachandran, Urmi Ray, Aurel Gunterus, Brian Matthew Henderson
المصدر: International Symposium on Microelectronics. 2017:000325-000330
مصطلحات موضوعية: 010302 applied physics, Engineering, business.industry, 020208 electrical & electronic engineering, Electrical engineering, Hardware_PERFORMANCEANDRELIABILITY, 02 engineering and technology, Integrated circuit design, Chip, 01 natural sciences, law.invention, Printed circuit board, Particle board, law, 0103 physical sciences, Automotive Engineering, Hardware_INTEGRATEDCIRCUITS, 0202 electrical engineering, electronic engineering, information engineering, Electronic engineering, Wafer testing, business, Wafer-level packaging, Flip chip
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::7e234c9e8cbe22c1074d3a9857fb3c1f
https://doi.org/10.4071/isom-2017-wp11_048 -
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4كتاب إلكتروني
المؤلفون: Riko Radojcic
نوع المادة: eBook.
الموضوعات: Electrical engineering--Management, Semiconductor industry, Embedded computer systems, Systems integration
تصنيفات: TECHNOLOGY & ENGINEERING / Electronics / Circuits / General, BUSINESS & ECONOMICS / Industrial Management, SOCIAL SCIENCE / General, TECHNOLOGY & ENGINEERING / Industrial Engineering
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المؤلفون: Bernard Adams, Riko Radojcic, Seung Wook Yoon, Andy Yong, Duk Ju Na, Won Kyung Choi, Urmi Ray, Jae Sik Lee
المصدر: Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2016:000809-000825
مصطلحات موضوعية: Interconnection, Engineering, Through-silicon via, business.industry, Ball grid array, Electronic engineering, Interposer, Pharmacology (medical), business, Chip, Wafer-level packaging, Die (integrated circuit), Embedded Wafer Level Ball Grid Array
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::ec22981d95111231606ba01bcdeff2e3
https://doi.org/10.4071/2016dpc-tp24 -
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المؤلفون: Bernard Adams, Riko Radojcic, Andy Yong, Kyaw Oo Aung, Jae Sik Lee, Won Kyoung Choi, Urmi Ray, Seung Wook Yoon, Duk Ju Na
المصدر: International Symposium on Microelectronics. 2015:000822-000826
مصطلحات موضوعية: Computer science, business.industry, Ball grid array, Automotive Engineering, Optoelectronics, Wafer, Ultra fine, business, Multi layer, Embedded Wafer Level Ball Grid Array
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::e80e4eb5946a9e7b1aac83cdc522fb51
https://doi.org/10.4071/isom-2015-thp34 -
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المؤلفون: Riko Radojcic
المصدر: Managing More-than-Moore Integration Technology Development ISBN: 9783319927008
مصطلحات موضوعية: medicine.medical_specialty, Endocrinology, Internal medicine, media_common.quotation_subject, medicine, Art, Hype cycle, media_common
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::ba52dc2cbcfce469a4c9df53777714c4
https://doi.org/10.1007/978-3-319-92701-5_10 -
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المؤلفون: Riko Radojcic
المصدر: Managing More-than-Moore Integration Technology Development ISBN: 9783319927008
مصطلحات موضوعية: Conference room, Brainstorming, Computer science, Value (economics), Manufacturing engineering
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::50ae24fd5af9e1f63296793bebc05d06
https://doi.org/10.1007/978-3-319-92701-5_5 -
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المؤلفون: Riko Radojcic
المصدر: Managing More-than-Moore Integration Technology Development ISBN: 9783319927008
مصطلحات موضوعية: Engineering management, Engineering, Focus (computing), Brainstorming, business.industry, Technology development, business
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::bb7c03bf45cd54e3e029f6173910ad01
https://doi.org/10.1007/978-3-319-92701-5_6 -
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المؤلفون: Riko Radojcic
المصدر: Managing More-than-Moore Integration Technology Development ISBN: 9783319927008
مصطلحات موضوعية: Engineering, TheoryofComputation_COMPUTATIONBYABSTRACTDEVICES, ComputerSystemsOrganization_COMPUTERSYSTEMIMPLEMENTATION, business.industry, Engineering ethics, Technology development, business, ComputingMilieux_MISCELLANEOUS
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::2b601e6445abef643289ed4ef4b66d0f
https://doi.org/10.1007/978-3-319-92701-5_14