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1دورية أكاديمية
المؤلفون: Yu-Ying Phoebe Hsieh, Wanting Sun, Janet M Young, Robin Cheung, Deborah A Hogan, Ajai A Dandekar, Harmit S Malik
المصدر: PLoS Biology, Vol 22, Iss 6, p e3002694 (2024)
مصطلحات موضوعية: Biology (General), QH301-705.5
وصف الملف: electronic resource
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المؤلفون: Emanuele Mandelli, Andras G. Pattantyus-Abraham, Erin Hanelt, Zach M. Beiley, Jet Meitzner, Jae Park, Robin Cheung, Edward H. Sargent
المصدر: Physics and Simulation of Optoelectronic Devices XXV.
مصطلحات موضوعية: CMOS sensor, Materials science, Pixel, business.industry, Transistor, ComputingMethodologies_IMAGEPROCESSINGANDCOMPUTERVISION, law.invention, CMOS, Stack (abstract data type), Feature (computer vision), law, Shutter, Optoelectronics, Image sensor, business
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::f3dc565765de12dc7b1b9cb8803830c4
https://doi.org/10.1117/12.2253219 -
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المؤلفون: Wei-Lun Jen, Frank Palmieri, Brook Chao, Michael Lin, Jianjun Hao, Jordan Owens, Ken Sotoodeh, Robin Cheung, C. Grant Willson
المصدر: SPIE Proceedings.
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::11144746d200656d6af014301fc670af
https://doi.org/10.1117/12.711602 -
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المؤلفون: Srinivas Gandikota, Robin Cheung, S. Ramanathan, Deenesh Padhi, Suketu A. Parikh, C. McGuirk, R. Emami, G. Dixit
المصدر: Proceedings of the IEEE 2002 International Interconnect Technology Conference (Cat. No.02EX519).
مصطلحات موضوعية: Materials science, Physics::Instrumentation and Detectors, Annealing (metallurgy), Metallurgy, chemistry.chemical_element, Copper, Grain size, Physics::Fluid Dynamics, Condensed Matter::Materials Science, chemistry, Residual stress, Condensed Matter::Superconductivity, Stress relaxation, Wafer, Electroplating, Current density
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::a07556d386fbb624ea50e060878b2996
https://doi.org/10.1109/iitc.2002.1014932 -
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المؤلفون: Alain Duboust, Robin Cheung, Srinivas Gandikota, Siew Neo, Liang-Yuh Chen, Daniel A. Carl
المصدر: Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407).
مصطلحات موضوعية: Yield (engineering), Materials science, business.industry, Pulse (signal processing), Metallurgy, food and beverages, chemistry.chemical_element, Copper, chemistry, Plating, Copper plating, Optoelectronics, business, Electroplating, Layer (electronics), Deposition (law)
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::b78270584d67ef84249e4280c147845a
https://doi.org/10.1109/iitc.2000.854336 -
6مؤتمر
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7مؤتمر
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8مؤتمر
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