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المؤلفون: Robin Priewald, Alexander Fuchs, Franz Pernkopf
المصدر: 2020 31st Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC).
مصطلحات موضوعية: 0209 industrial biotechnology, Artificial neural network, Computer science, business.industry, System of measurement, Stability (learning theory), Pattern recognition, 02 engineering and technology, Edge (geometry), Laser, law.invention, Footprint, 020901 industrial engineering & automation, law, 0202 electrical engineering, electronic engineering, information engineering, 020201 artificial intelligence & image processing, Wafer, Artificial intelligence, False positive rate, business
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::4e52c7c3722fb907eda9d348d38a197d
https://doi.org/10.1109/asmc49169.2020.9185278 -
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المؤلفون: Robin Priewald, Christian Mentin, Eugen Brenner
المصدر: Measurement. 125:406-414
مصطلحات موضوعية: CMOS sensor, Observational error, Computer science, Applied Mathematics, 020208 electrical & electronic engineering, Triangulation (social science), Particle swarm optimization, 02 engineering and technology, Edge (geometry), Condensed Matter Physics, 01 natural sciences, Collimated light, 010309 optics, Position (vector), 0103 physical sciences, Shadow, 0202 electrical engineering, electronic engineering, information engineering, Electrical and Electronic Engineering, Instrumentation, Algorithm
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المؤلفون: Robin Priewald, Alexander Fuchs, Franz Pernkopf
المصدر: ICMLA
مصطلحات موضوعية: Computer science, business.industry, 0206 medical engineering, Frame (networking), 020206 networking & telecommunications, Pattern recognition, 02 engineering and technology, 020601 biomedical engineering, Task (project management), Recurrent neural network, Time-series segmentation, 0202 electrical engineering, electronic engineering, information engineering, Key (cryptography), Segmentation, Artificial intelligence, Focus (optics), business
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::6428e638289562f9ba5512ebc2124272
https://doi.org/10.1109/icmla.2019.00021 -
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المؤلفون: Tatiana Strapacova, Thomas Jerman, Robin Priewald, Christian Mentin
المصدر: 2017 28th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC).
مصطلحات موضوعية: Absorption (acoustics), Yield (engineering), Computer science, Continuous monitoring, Mechanical engineering, ComputerApplications_COMPUTERSINOTHERSYSTEMS, Ranging, Hardware_PERFORMANCEANDRELIABILITY, Transparency (human–computer interaction), Edge (geometry), Edge detection, Hardware_INTEGRATEDCIRCUITS, Electronic engineering, Wafer
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::aebb6d150be2fdc3d4998f12cc2d2071
https://doi.org/10.1109/asmc.2017.7969214 -
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المؤلفون: Eugen Brenner, Christian Mentin, Robin Priewald
المصدر: 2016 International Conference on Broadband Communications for Next Generation Networks and Multimedia Applications (CoBCom).
مصطلحات موضوعية: Diffraction, Physics, Pixel, business.industry, Detector, Resolution (electron density), ComputingMethodologies_IMAGEPROCESSINGANDCOMPUTERVISION, Subpixel rendering, Edge detection, Optics, Computer vision, Artificial intelligence, Image sensor, business, Sub-pixel resolution
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::265ae6e2192466283a47aa38a8a87fcf
https://doi.org/10.1109/cobcom.2016.7593498 -
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المؤلفون: Robin Priewald, Walter Leitgeb, Thomas Jerman
المصدر: 2012 SEMI Advanced Semiconductor Manufacturing Conference.
مصطلحات موضوعية: Wafer-scale integration, Materials science, business.industry, Detector, ComputerApplications_COMPUTERSINOTHERSYSTEMS, Ranging, Hardware_PERFORMANCEANDRELIABILITY, Wafer backgrinding, Embedded Wafer Level Ball Grid Array, chemistry.chemical_compound, chemistry, Hardware_INTEGRATEDCIRCUITS, Electronic engineering, Silicon carbide, Optoelectronics, Wafer, Wafer dicing, business
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::acdc6eb8499e911e02ca194051e956f7
https://doi.org/10.1109/asmc.2012.6212918