المؤلفون: Jouve, A., Lagoutte, E., Crochemore, R., Mauguen, G., Flahaut, T., Dubarry, C., Balan, V., Fournel, F., Bourjot, E., Servant, F., Scannell, M., Rohracher, K., Bodner, T., Faes, A., Hofrichter, J.

المصدر: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :201-209 Jun, 2020

Relation: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

المؤلفون: Kock, A., Deluca, M., Sosada-Ludwikowska, F., Wimmer-Teubenbacher, R., Lackner, E., Rohracher, K., Wachmann, E., Niehaus, J. S., Becker, S., Steinhauer, S., Sowwan, M., Singh, V., Tokmak, O.

المصدر: 2018 12th International Conference on Advanced Semiconductor Devices and Microsystems (ASDAM) Advanced Semiconductor Devices and Microsystems (ASDAM), 2018 12th International Conference on. :1-5 Oct, 2018

Relation: 2018 12th International Conference on Advanced Semiconductor Devices and Microsystems (ASDAM)

المؤلفون: Vyrsokinos, Konstantinos, Moralis-Pegios, M., Vagionas, C., Brimont, A., Zanzi, A., Sanchis, P., Marti, J., Kraft, J., Rohracher, K., Dorrestein, S., Bogdan, M., Pleros, N.

المصدر: 2016 18th International Conference on Transparent Optical Networks (ICTON) Transparent Optical Networks (ICTON), 2016 18th International Conference on. :1-4 Jul, 2016

Relation: 2016 18th International Conference on Transparent Optical Networks (ICTON)

المؤلفون: Ioannidis, E.G., Rohracher, K., Enichlmair, H.

المصدر: In Solid State Electronics May 2020 167

المؤلفون: Ioannidis, E.G., Rohracher, K., Roger, F., Pflanzl, W.C., Leisenberger, F.P., Wachmann, E., Seebacher, E., Vescoli, V.

المصدر: In Solid State Electronics September 2017 135:1-7

المؤلفون: Lackner, E., Krainer, J., Wimmer-Teubenbacher, R., Sosada, F., Gspan, C., Rohracher, K., Wachmann, E., Koeck, A.

المصدر: In Procedia Engineering 2016 168:297-300

المؤلفون: Krainer, J., Deluca, M., Lackner, E., Wimmer-Teubenbacher, R., Sosada, F., Gspan, C., Rohracher, K., Wachmann, E., Koeck, A.

المصدر: In Procedia Engineering 2016 168:272-275

المؤلفون: Wimmer-Teubenbacher, R., Steinhauer, S., von Sicard, O., Magori, E., Siegert, J., Rohracher, K., Gspan, C., Grogger, W., Köck, A.

المصدر: In Materials Today: Proceedings 2015 2(8):4295-4301

المؤلفون: Mutinati, G.C., Brunet, E., Koeck, A., Steinhauer, S., Yurchenko, O., Laubender, E., Urban, G., Siegert, J., Rohracher, K., Schrank, F., Schrems, M.

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المؤلفون: Koeck, A., Deluca, M., Sosada-Ludwikowska, F., Wimmer-Teubenbacher, R., Lackner, E., Rohracher, K., Wachmann, E., Niehaus, J. S., Becker, S., Tokmak, Oe., Steinhauer, Stephan, Sowwan, M., Singh, V.

المصدر: ASDAM 2018 - Proceedings: 12th International Conference on Advanced Semiconductor Devices and Microsystems International Conference on Advanced Semiconductor Devices and Microsystems. :227-231

وصف الملف: print

URL الوصول: https://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-252926