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المؤلفون: M. Guillorn, Deqiang Wang, Steve Rossnagel, Lynne Gignac, Qinghuang Lin, Sung-Wook Nam, Ajay K. Royyuru, Robert L. Bruce, Gustavo Stolovitzky, P. J. Litwinowicz, Armand Galan, Dirk Pfeiffer, Evan G. Colgan, Ronald D. Goldblatt, S. Papa Rao, J.J. Bucchignano, Markus Brink, Michael F. Lofaro, Chao Wang, W. H. Advocate, Elizabeth A. Duch, E. Kratschmer, C. M. Breslin, John M. Cotte, William Henry Price, Christopher V. Jahnes, Stas Polonsky, Hongbo Peng, Eric A. Joseph
المصدر: 2013 IEEE International Electron Devices Meeting.
مصطلحات موضوعية: Materials science, Wafer-scale integration, Silicon, technology, industry, and agriculture, chemistry.chemical_element, Nanofluidics, Nanotechnology, Lab-on-a-chip, law.invention, chemistry.chemical_compound, chemistry, Optical microscope, law, Fluorescence microscope, Molecule, DNA
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::7009e4a7a92742f8a8752e24815c32d7
https://doi.org/10.1109/iedm.2013.6724627 -
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المؤلفون: David Kramer, Gerard M. Salem, Ronald D. Goldblatt, J. Corr, Robert M. Houle, D. Cawthron, P. McCormick, Paul D. Kartschoke, M. Canada, R. Schulz, J. Bialas, Norman J. Rohrer, R. Floyd, Stephen Frank Geissler, Bijan Davari, Chekib Akrout, L. Su, L. Whitney
المصدر: IEEE Journal of Solid-State Circuits. 33:1609-1616
مصطلحات موضوعية: Engineering, Reduced instruction set computing, business.industry, CPU cache, Transistor, PowerPC, Clock rate, Electrical engineering, law.invention, External Bus Interface, Microprocessor, CMOS, law, Embedded system, Hardware_INTEGRATEDCIRCUITS, Hardware_ARITHMETICANDLOGICSTRUCTURES, Electrical and Electronic Engineering, business
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المؤلفون: John E. Heidenreich, Luis M. Ferreiro, Richard R. Thomas, Sharon L. Nunes, T. H. Chao, Ned J. Chou, Leena Paivikki Buchwalter, Ronald D. Goldblatt
المصدر: Journal of Applied Polymer Science. 46:2189-2202
مصطلحات موضوعية: Polymers and Plastics, Chemistry, General Chemistry, Adhesion, Surfaces, Coatings and Films, Characterization (materials science), Metal, X-ray photoelectron spectroscopy, visual_art, Polymer chemistry, Materials Chemistry, visual_art.visual_art_medium, Surface modification, Composite material, Fourier transform infrared spectroscopy, Layer (electronics), Polyimide
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المؤلفون: W. Lai, Steven J. Holmes, Werner A. Rausch, Allen H. Gabor, Karl Paul Muller, Colin J. Brodsky, Ernest Y. Wu, Jeffrey J. Welser, Sujatha Sankaran, Ricardo A. Donaton, S. Wu, Ronald A. DellaGuardia, S.K.H. Fung, W. Yan, S.H. Ku, Steven W. Mittl, Anthony I. Chou, A. Vayshenker, J. Snare, Paul D. Agnello, Len Y. Tsou, Mukesh Khare, Michael A. Gribelyuk, Renee T. Mo, Robert J. Purtell, F. Jamin, P.A. McFarland, Akihisa Sekiguchi, D. Nielsen, D. Wehella-Gamage, Ronald D. Goldblatt, E. Barth, Richard A. Ferguson, Tina Wagner, Dominic J. Schepis, Shreesh Narasimha, Woo-Hyeong Lee, Bruce B. Doris, Percy V. Gilbert, Stephen E. Greco, X. Chen, Sadanand V. Deshpande, Yujun Li
المصدر: Digest. International Electron Devices Meeting.
مصطلحات موضوعية: Interconnection, Materials science, Silicon, business.industry, Gate dielectric, Copper interconnect, Electrical engineering, Silicon on insulator, chemistry.chemical_element, Hardware_PERFORMANCEANDRELIABILITY, Integrated circuit design, Dielectric, Stack (abstract data type), chemistry, Hardware_INTEGRATEDCIRCUITS, Optoelectronics, business
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::a76288235c918aa108b3bc11283b3430
https://doi.org/10.1109/iedm.2002.1175865 -
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المؤلفون: H. Ng, J. Oberschmidt, Michael J. Hargrove, Ronald D. Goldblatt, X. Chen, Deborah A. Ryan, E. J. Nowak, K. Tallman, T. Wagner, Stephen E. Greco, C. DeWan, Bijan Davari, E. Barth, J. Connolly, Klaus Dietrich Beyer, Richard A. Ferguson, Paul D. Agnello, P. McLaughlin, Emmanuel F. Crabbe, S. Crowder, R. Logan, Vincent J. McGahay, Robert J. Purtell, L. Su, Asit Kumar Ray, G. A. Biery
المصدر: 1999 Symposium on VLSI Technology. Digest of Technical Papers (IEEE Cat. No.99CH36325).
مصطلحات موضوعية: Space technology, Materials science, business.industry, Electrical engineering, Copper interconnect, Interconnect technology, Hardware_PERFORMANCEANDRELIABILITY, CMOS, Hardware_INTEGRATEDCIRCUITS, Cmos logic circuits, Optoelectronics, Static random-access memory, business, Electrical conductor, Lithography
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::8b2f55f6d9842bd12f56888f942545bc
https://doi.org/10.1109/vlsit.1999.799362 -
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المؤلفون: John J. Ritsko, W. Volksen, W. Graham, Donald C. Hofer, Richard P Mcgouey, J. W. Labadie, Sharon L. Nunes, J. L. Hedrick, Eileen A. Galligan, Katherine L. Saenger, G.V. Kopcsay, Jurij R. Paraszczak, Ronald D. Goldblatt, Russell J. Serino, Edward D. Babich, David F. Witman, Helen Li Yeh, Vincent Ranieri, Laura Beth Rothman, D. Y. Shih, Chandrasekhar Narayan, Janusz S. Wilczynski, J. Cataldo, Alina Deutsch, J. M. Shaw
المصدر: 1991 Proceedings 41st Electronic Components & Technology Conference.
مصطلحات موضوعية: Interconnection, Fabrication, Materials science, business.industry, Nominal impedance, chemistry.chemical_element, Copper, Signal, Planarity testing, Conductor, chemistry, Electronic engineering, Optoelectronics, business, Polyimide
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::78e9616fb680851b0094716eb1116ab8
https://doi.org/10.1109/ectc.1991.163901 -
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المؤلفون: G. Hellner, H. Harrer, G. A. Biery, L. Su, Emmanuel F. Crabbe, C.W. Surovic, Alina Deutsch, Paul W. Coteus, N.A. Greco, Ronald D. Goldblatt, Daniel C. Edelstein, D.M. Foster
المصدر: International Electron Devices Meeting 1998. Technical Digest (Cat. No.98CH36217).
مصطلحات موضوعية: Materials science, business.industry, Electrical engineering, chemistry.chemical_element, Atmospheric temperature range, Copper, law.invention, Crosstalk, Modeling and simulation, Microprocessor, chemistry, law, Aluminium, Optoelectronics, Waveform, Wafer, business
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::d77e04c8f5c5e0d101e9dbff2f42d756
https://doi.org/10.1109/iedm.1998.746358 -
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المؤلفون: E. Eld, R. Schulz, T. Wagner, Daniel C. Edelstein, Janet S. Herman, William J. Cote, C. Guenther, L. Su, H. Ng, John E. Heidenreich, R. Gehres, K. Beyer, N. Greco, C. Megivern, Asit Kumar Ray, J. Oberschmidt, G. A. Biery, J. McKenna, D. Kiesling, Bijan Davari, D. Foster, Ronald D. Goldblatt, Norman J. Rohrer, K. Tallman, J. Ellis-Monaghan, Emmanuel F. Crabbe, James W. Adkisson, S.-H. Lo, L. Lin
المصدر: 1998 Symposium on VLSI Technology Digest of Technical Papers (Cat. No.98CH36216).
مصطلحات موضوعية: Engineering, business.industry, Electrical engineering, Copper interconnect, ComputerApplications_COMPUTERSINOTHERSYSTEMS, Hardware_PERFORMANCEANDRELIABILITY, law.invention, Threshold voltage, Microprocessor, CMOS, law, Logic gate, Hardware_INTEGRATEDCIRCUITS, Inverter, Static random-access memory, business, Scaling
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::63495eea98cb264eda546d513ed0cc30
https://doi.org/10.1109/vlsit.1998.689182 -
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المؤلفون: A.K. Stamper, T. Katsetos, P. C. Andricacos, John E. Heidenreich, Stephen E. Luce, John Owen Dukovic, Ronald D. Goldblatt, Naftali E. Lustig, Richard A. Wachnik, J. Slattery, Daniel C. Edelstein, A. Simon, Thomas L. McDevitt, H. S. Rathore, Cyprian E. Uzoh, William J. Cote, P. McLaughlin
المصدر: Proceedings of the IEEE 1998 International Interconnect Technology Conference (Cat. No.98EX102).
مصطلحات موضوعية: Functional verification, Materials science, business.industry, Electrical engineering, Copper interconnect, Ranging, Hardware_PERFORMANCEANDRELIABILITY, Stress testing (software), law.invention, Microprocessor, Reliability (semiconductor), CMOS, law, Hardware_INTEGRATEDCIRCUITS, Static random-access memory, business
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::847939bd04f73a3e4baee4d7e4937c68
https://doi.org/10.1109/iitc.1998.704776 -
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المؤلفون: L. Su, Naftali E. Lustig, John E. Heidenreich, Cyprian E. Uzoh, Peter Roper, Stephen E. Luce, R. Schulz, Richard A. Wachnik, William J. Cote, A. Simon, Ronald D. Goldblatt, J. Dukovic, W. Motsiff, J. Slattery, Daniel C. Edelstein, H. Rathore, Thomas L. McDevitt
المصدر: International Electron Devices Meeting. IEDM Technical Digest.
مصطلحات موضوعية: Engineering, business.industry, Copper-wiring, Copper interconnect, Electrical engineering, chemistry.chemical_element, Hardware_PERFORMANCEANDRELIABILITY, Copper, Reliability (semiconductor), chemistry, CMOS, Hardware_INTEGRATEDCIRCUITS, Optoelectronics, Static random-access memory, business, Current density, Scaling
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::562fb72b2e9b5262a16ac9dec8cab0e7
https://doi.org/10.1109/iedm.1997.650496