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المؤلفون: Brian Elolampi, Dan Davis, John Work, Stephen P. Lee, Kevin Dowling, Mitul Dalal, Conor S. Rafferty, Rooz Ghaffari, Yung-Yu Hsu, Kylie Lucas
المصدر: 2013 IEEE 63rd Electronic Components and Technology Conference.
مصطلحات موضوعية: Reliability (semiconductor), Materials science, business.industry, Numerical analysis, Complex system, Mechanical engineering, Structural engineering, Electronics, Thin film, Conformable matrix, business, Multi layer, Electronic systems
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::c88f89d78ce8ccbb10f353e82ef1a6ee
https://doi.org/10.1109/ectc.2013.6575638 -
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المؤلفون: Barry G. Ives, Dan Davis, Briana Morey, Kevin Dowling, James Hoffman, Conor Rafferty, Pinghung Wei, Lauren Klinker, Yung-Yu Hsu, Brian Elolampi, Rooz Ghaffari
المصدر: 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
مصطلحات موضوعية: Sensor system, SWEAT, Materials science, business.industry, Electrical engineering, Sweat patch, Electronics, business, Sensitivity (electronics), Capacitance, Electrical impedance, Electrical conductor, Biomedical engineering
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::2407690273fbb2cd0451e6b7cba1e5dd
https://doi.org/10.1109/impact.2012.6420313