يعرض 1 - 4 نتائج من 4 نتيجة بحث عن '"Rotanson, Jason"', وقت الاستعلام: 0.89s تنقيح النتائج
  1. 1
    مؤتمر
    Flexible Integrated Battery on System-in-Package (SiP) for Internet of Things (IoT) and Smart Wearables

    المؤلفون: Pun, Kelvin P. L, Rotanson, Jason, Chan, Yuen Yung, Hon, Wing Lung, Lu, Shengbo, Liu, Tracy C. M., Dhaka, Navdeep S., Cheung, Chee

    المصدر: 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2021 IEEE 23rd. :270-275 Dec, 2021

    Relation: 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)

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  2. 2
    مؤتمر
    Demonstration of Ni-free Surface Finishing with IGEPIG for Solid-State Diffusion Bonding on Ultra-fine Pitch Chip-on-Film (COF)

    المؤلفون: Pun, Kelvin P. L., Rotanson, Jason, Dhaka, Navdeep S., Cheung, Chee-Wah, Chan, Alan H. S.

    المصدر: 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2018 IEEE 20th. :924-931 Dec, 2018

    Relation: 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC)

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  3. 3
    دورية أكاديمية
    Enhancement of Sn-Bi-Ag Solder Joints with ENEPIG Surface Finish for Low-Temperature Interconnection

    المؤلفون: Pun, Kelvin P. L.Aff1, Islam, M. N., Rotanson, Jason, Cheung, Chee-wah, Chan, Alan H. S.

    المصدر: Journal of Electronic Materials. 47(9):5191-5202

    Find this article in full text from Springer Verlag. Find this article in full text from ProQuest Full Text Finder
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  4. 4
    دورية أكاديمية
    Application of Fuzzy Integrated FMEA with Product Lifetime Consideration for New Product Development in Flexible Electronics Industry.

    المؤلفون: Pun, Kelvin P. L., Rotanson, Jason, Chee-Wah Cheung, Chan, Alan H. S.

    المصدر: Journal of Industrial Engineering & Management; 2019, Vol. 12 Issue 1, p176-200, 25p

    مصطلحات موضوعية: NEW product development, FLEXIBLE electronics, FAILURE mode & effects analysis, INDUSTRIAL electronics, MASS production, AGRICULTURAL technology, HIGH technology

    Find this article in full text from ProQuest Full Text Finder
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