المؤلفون: de Saxce, Joseph M., Roux-Levy, Philippe, Siah, Chun Fei, Wang, Jianxiong, Tay, Beng Kang, Coquet, Philippe, Baillargeat, Dominique

المصدر: 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2020 IEEE 22nd. :81-84 Dec, 2020

Relation: 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC)

المؤلفون: Roux-Levy, Philippe, De Saxce, Joseph M., Siah, Chun Fei, Wang, Jianxiong, Tay, Beng Kang, Coquet, Philippe, Baillargeat, Dominique

المصدر: 2020 IEEE/MTT-S International Microwave Symposium (IMS) Microwave Symposium (IMS), 2020 IEEE/MTT-S International. :1047-1050 Aug, 2020

Relation: 2020 IEEE/MTT-S International Microwave Symposium (IMS)

المؤلفون: Siah, Chun Fei, Wang, Jianxiong, Roux-Levy, Philippe, Coquet, Philippe, Tay, Beng Kang, Baillargeat, Dominique

المصدر: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2019 IEEE 21st. :574-577 Dec, 2019

Relation: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC)

المؤلفون: Tan, Dunlin, Cometto, Mathieu, Roux-Levy, Philippe, Coquet, Philippe, Kang, Tay Beng, Baillargeat, Dominique

المصدر: 2018 IEEE 18th International Conference on Nanotechnology (IEEE-NANO) Nanotechnology (IEEE-NANO), 2018 IEEE 18th International Conference on. :1-4 Jul, 2018

Relation: 2018 IEEE 18th International Conference on Nanotechnology (IEEE-NANO)

المؤلفون: Saxce, Joseph de, Roux-Levy, Philippe, Fei, Siah Chun, Wang, Jianxiong, Kang, Tay Beng, Coque, Philippe, Baillargeat, Dominique

المصدر: 2019 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP) Advanced Materials and Processes for RF and THz Applications (IMWS-AMP), 2019 IEEE MTT-S International Microwave Workshop Series on. :124-126 Jul, 2019

Relation: 2019 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP)

المؤلفون: Roux-Levy, Philippe, Baillargeat, Dominique, Tay, Beng Kang, Coquet, Philippe

المصدر: 2017 IEEE 17th International Conference on Nanotechnology (IEEE-NANO) Nanotechnology (IEEE-NANO), 2017 IEEE 17th International Conference on. :907-910 Jul, 2017

Relation: 2017 IEEE 17th International Conference on Nanotechnology (IEEE-NANO)

المؤلفون: Cometto, Mathieu, Roux-Levy, Philippe, Frigui, Kamel, Bila, Stephane, Coquet, Philippe, Kang, Tay Beng, Baillargeat, Dominique

المصدر: 2018 IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization (NEMO) Numerical Electromagnetic and Multiphysics Modeling and Optimization (NEMO), 2018 IEEE MTT-S International Conference on. :1-3 Aug, 2018

Relation: 2018 IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization (NEMO)

المؤلفون: Roux-Levy, Philippe

المساهمون: Systèmes RF (XLIM-SRF), XLIM (XLIM), Université de Limoges (UNILIM)-Centre National de la Recherche Scientifique (CNRS)-Université de Limoges (UNILIM)-Centre National de la Recherche Scientifique (CNRS), Université de Limoges, Dominique Baillargeat

المصدر: Micro et nanotechnologies/Microélectronique. Université de Limoges, 2018. Français. ⟨NNT : 2018LIMO0102⟩

مصطلحات موضوعية: Composants RF, Extremely high frequency, Interconnects, Carbon nanotubes, Nano-packaging, Flipchip, Extrêmement hautes fréquences, [SPI.NANO]Engineering Sciences [physics]/Micro and nanotechnologies/Microelectronics, Nanotube de carbone, RF components, Flip-chip, Interconnexions

URL الوصول: https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::2c8b75ce4a49de36e3c035f045033c22
https://tel.archives-ouvertes.fr/tel-02018707/document

المؤلفون: Roux-Levy, Philippe

المساهمون: STAR, ABES

مصطلحات موضوعية: Composants RF, Interconnects, Extremely high frequency, [SPI.NANO] Engineering Sciences [physics]/Micro and nanotechnologies/Microelectronics, Carbon nanotubes, Nano-packaging, Flipchip, Extrêmement hautes fréquences, Nanotube de carbone, Flip-chip, RF components, Interconnexions

وصف الملف: application/pdf

URL الوصول: https://explore.openaire.eu/search/publication?articleId=od_______166::2c8b75ce4a49de36e3c035f045033c22
https://theses.hal.science/tel-02018707