يعرض 1 - 10 نتائج من 32 نتيجة بحث عن '"Rudnyi, E. B."', وقت الاستعلام: 0.84s تنقيح النتائج
  1. 1
    مؤتمر
    Stress Recovery in the Reduced Space for Parametric Reduced Models in Microelectronics

    المؤلفون: Zawra, I., Umunnakwe, C. B., Soestbergen, M. van, Rudnyi, E. B., Bechtold, T.

    المصدر: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2023 24th International Conference on. :1-6 Apr, 2023

    Relation: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

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  2. 2
    مؤتمر
    Thermo-Mechanical Super-Element of a Packaged-Chip Model for Re-Integrating Reduced State-Space Models into Finite Element Environment

    المؤلفون: Umunnakwe, C. B., Zawra, I., Rudnyi, E. B., Niessner, M., Bechtold, T.

    المصدر: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2023 24th International Conference on. :1-6 Apr, 2023

    Relation: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

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  3. 3
    مؤتمر
    Model Order Reduction of a Thermo-Mechanical Packaged Chip Model for automotive MOSFET applications

    المؤلفون: Umunnakwe, C. B., Zawra, I., Yuan, C., Rudnyi, E. B., Hohlfeld, D., Niessner, M., Bechtold, T.

    المصدر: 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2022 23rd International Conference on. :1-5 Apr, 2022

    Relation: 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

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  4. 4
    مؤتمر
    Model order reduction and system simulation of a machine tool for real-time compensation of thermally induced deformations

    المؤلفون: Yuan, C. D., Rudnyi, E. B., Baumgartl, H., Bechtold, T.

    المصدر: 2017 IEEE International Conference on Advanced Intelligent Mechatronics (AIM) Advanced Intelligent Mechatronics (AIM), 2017 IEEE International Conference on. :1071-1076 Jul, 2017

    Relation: 2017 IEEE International Conference on Advanced Intelligent Mechatronics (AIM)

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  5. 5
    مؤتمر
    Structure preserving model order reduction and system level simulation of MEMS piezoelectric energy harvester

    المؤلفون: Kudryavtsev, M., Hohlfeld, D., Rudnyi, E. B., Bechtold, T., Korvink, J. G.

    المصدر: Proceedings of the 5th Electronics System-integration Technology Conference (ESTC) Electronics System-Integration Technology Conference (ESTC), 2014. :1-5 Sep, 2014

    Relation: 2014 Electronics System-Integration Technology Conference (ESTC)

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  6. 6
    مؤتمر
    Computationally efficient and stable order reduction method for a large-scale model of MEMS piezoelectric energy harvester

    المؤلفون: Kudryavtsev, M., Rudnyi, E. B., Bechtold, T., Korvink, J. G.

    المصدر: 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (eurosime), 2014 15th international conference on. :1-5 Apr, 2014

    Relation: 2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

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  7. 7
    دورية أكاديمية

    لا يتم عرض هذه النتيجة على الضيوف.

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  8. 8
    مؤتمر
    Efficient extraction of thin film thermal properties via parametric model order reduction and optimization

    المؤلفون: Bechtold, T., Hohlfeld, D., Rudnyi, E. B.

    المصدر: TRANSDUCERS 2009 - 2009 International Solid-State Sensors, Actuators and Microsystems Conference Solid-State Sensors, Actuators and Microsystems Conference, 2009. TRANSDUCERS 2009. International. :2437-2440 Jun, 2009

    Relation: TRANSDUCERS 2009 - 2009 International Solid-State Sensors, Actuators and Microsystems Conference

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  9. 9
    مؤتمر
    System-level model of electrothermal microsystem with temperature control circuit

    المؤلفون: Bechtold, T., Rudnyi, E. B., Hohlfeld, D.

    المصدر: 2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2011 12th International Conference on. :1/5-5/5 Apr, 2011

    Relation: 2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

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  10. 10
    كتاب إلكتروني
    Ion Equilibria : A New Technique for Measurement of Low 02 and Alkali Partial Pressures

    المؤلفون: Rudnyi, E. B.Aff2, Korobov, M. V.Aff2, Vovk, O. M.Aff2, Kaibicheva, E. A.Aff2, Sidorov, L. N.Aff2

    المساهمون: Hastie, John W., editorAff1

    المصدر: Materials Chemistry at High Temperatures : Characterization. 1:165-174

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