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1مؤتمر
المؤلفون: Loreto, Fabrizio, Romano, Daniele, Antonini, Giulio, Stumpf, Martin, Ruehli, Albert E., Ekman, Jonas
المصدر: 2023 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Advanced Packaging and Systems (EDAPS), 2023 IEEE Electrical Design of. :1-3 Dec, 2023
Relation: 2023 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)
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2تقرير
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3مؤتمر
المصدر: 2023 International Conference on Electromagnetics in Advanced Applications (ICEAA) Electromagnetics in Advanced Applications (ICEAA), 2023 International Conference on. :360-360 Oct, 2023
Relation: 2023 International Conference on Electromagnetics in Advanced Applications (ICEAA)
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4مؤتمر
المصدر: 2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium EMC/SI/PI and EMC Europe Symposium, 2021 IEEE International Joint. :940-945 Jul, 2021
Relation: 2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium
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5مؤتمر
المؤلفون: Li, Mengxuan, Bai, Siqi, Makharashvili, Tamar, Ruehli, Albert E., Drewniak, James L., Beetner, Daryl
المصدر: 2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium EMC/SI/PI and EMC Europe Symposium, 2021 IEEE International Joint. :549-553 Jul, 2021
Relation: 2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium
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6تقرير
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7مؤتمر
المؤلفون: Ruehli, Albert E., Lombardi, Luigi, Antonini, Giulio, Tao, Ye, Nakhla, Michel S., Ferranti, Francesco
المصدر: 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) Electrical Performance of Electronic Packaging and Systems (EPEPS), 2019 IEEE 28th Conference on. :1-3 Oct, 2019
Relation: 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)
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8مؤتمر
المؤلفون: Jiang, Lijun, Ruehli, Albert E.
المصدر: 2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI) Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI), 2018 IEEE Symposium on. :1-51 Jul, 2018
Relation: 2018 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)
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9مؤتمر
المؤلفون: Ruehli, Albert E., Jiang, Lijun, Antonini, Giulio
المصدر: 2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI) Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI), 2018 IEEE Symposium on. :1-30 Jul, 2018
Relation: 2018 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)
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10مؤتمر
المؤلفون: Makharashvili, T., Bai, S., Cecchini, M., Ruehli, A. E., Berger, P., Drewniak, J., Beetner, D. G.
المصدر: 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) Electrical Performance of Electronic Packaging and Systems (EPEPS), 2018 IEEE 27th Conference on. :245-247 Oct, 2018
Relation: 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)