يعرض 1 - 10 نتائج من 175 نتيجة بحث عن '"Rzepka, Sven"', وقت الاستعلام: 0.86s تنقيح النتائج
  1. 1
    مؤتمر
    Digital Twin-Based Lifetime Estimation of SiC Power Modules

    المؤلفون: Mathew, Anu, Rzepka, Sven, Heimler, Patrick, Xie, Dong, Alaluss, Mohamed, Basler, Thomas

    المصدر: 2024 36th International Symposium on Power Semiconductor Devices and ICs (ISPSD) Power Semiconductor Devices and ICs (ISPSD), 2024 36th International Symposium on. :478-481 Jun, 2024

    Relation: 2024 36th International Symposium on Power Semiconductor Devices and ICs (ISPSD)

    Full Text Finder
    أضف إلى المفضلة
  2. 2
    مؤتمر
    Reduced-Order Model for Solder Balls – Potential of projection-based approaches for representing viscoplastic behavior

    المؤلفون: Feuchter, Mike, Baumgartl, Hanna, Hanke, Martin, Rzepka, Sven, Wunderle, Bernhard

    المصدر: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024 25th International Conference on. :1-8 Apr, 2024

    Relation: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

    Full Text Finder
    أضف إلى المفضلة
  3. 3
    مؤتمر
    Solder Fatigue Analyses and Predictions for PCB Mounted Components after Thirteen Years of Thermal Field Cycling

    المؤلفون: Dudek, Rainer, Doring, Ralf, Kreysig, Kerstin, Rzepka, Sven, Fruehauf, Peter, Weigert, Andreas

    المصدر: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024 25th International Conference on. :1-13 Apr, 2024

    Relation: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

    Full Text Finder
    أضف إلى المفضلة
  4. 4
    مؤتمر
    Investigation of an approach for the determination of the current State-of-Health and improvement of service life in power modules

    المؤلفون: Chacko, Jain, Moeller, Heiner, Kolas, Kshitij Anil, Albrecht, Jan, Rzepka, Sven

    المصدر: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024 25th International Conference on. :1-9 Apr, 2024

    Relation: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

    Full Text Finder
    أضف إلى المفضلة
  5. 5
    مؤتمر
    Mission Profile related Design for Reliability for Power Electronics based on Finite Element Simulation

    المؤلفون: Albrecht, Jan, Horn, Tobias, Habenicht, Sonke, Rzepka, Sven

    المصدر: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2023 IEEE 25th. :722-726 Dec, 2023

    Relation: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)

    أضف إلى المفضلة
  6. 6
    مؤتمر
    A Data-driven Condition Monitoring method to predict the Remaining Useful Life of SiC Power Modules for Traction Inverters

    المؤلفون: Di Nuzzo, Giovanni, Lewitschnig, Horst, Tuellmann, Marc, Rzepka, Sven, Otto, Alexander

    المصدر: 2023 IEEE International Conference on Prognostics and Health Management (ICPHM) Prognostics and Health Management (ICPHM), 2023 IEEE International Conference on. :312-319 Jun, 2023

    Relation: 2023 IEEE International Conference on Prognostics and Health Management (ICPHM)

    Full Text Finder
    أضف إلى المفضلة
  7. 7
    مؤتمر
    Failure Prediction and Analysis of an IGBT Module for Industrial Applications Subjected to Passive and Power Cycling

    المؤلفون: Dudek, Rainer, Otto, Alexander, Doring, Ralf, Mathew, Anu, Liu, Xing, Rzepka, Sven

    المصدر: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2023 24th International Conference on. :1-11 Apr, 2023

    Relation: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

    Full Text Finder
    أضف إلى المفضلة
  8. 8
    مؤتمر
    Physics of Degradation based Surrogate Model using Deep Learning for Lifetime Prognostics of Solder Joints in Microelectronics

    المؤلفون: Albrecht, Jan, Rzepka, Sven

    المصدر: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2022 IEEE 24th. :759-762 Dec, 2022

    Relation: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)

    أضف إلى المفضلة
  9. 9
    مؤتمر
    Improving the production quality and robustness of a SO16 sensor package by a simulation based digital twin approach

    المؤلفون: Moeller, Heiner, Knoll, Heiko, Hille, Pascal, Dudek, Rainer, Rzepka, Sven

    المصدر: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) Electronics System-Integration Technology Conference (ESTC), 2022 IEEE 9th. :203-209 Sep, 2022

    Relation: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC)

    أضف إلى المفضلة
  10. 10
    مؤتمر
    Building reliable FE simulation models for a better behavior prediction of power electronic systems

    المؤلفون: Moller, Heiner, Dudek, Rainer, Otto, Alexander, Rzepka, Sven

    المصدر: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2022 21st IEEE Intersociety Conference on. :1-8 May, 2022

    Relation: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)

    Full Text Finder
    أضف إلى المفضلة
أدوات البحث: أحصل على تغذية RSS – أرسل هذا البحث بالبريد الإلكتروني – حفظ البحث – جدول التنبيهات: لا شيء