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1مؤتمر
المؤلفون: Mathew, Anu, Rzepka, Sven, Heimler, Patrick, Xie, Dong, Alaluss, Mohamed, Basler, Thomas
المصدر: 2024 36th International Symposium on Power Semiconductor Devices and ICs (ISPSD) Power Semiconductor Devices and ICs (ISPSD), 2024 36th International Symposium on. :478-481 Jun, 2024
Relation: 2024 36th International Symposium on Power Semiconductor Devices and ICs (ISPSD)
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2مؤتمر
المصدر: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024 25th International Conference on. :1-8 Apr, 2024
Relation: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
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3مؤتمر
المؤلفون: Dudek, Rainer, Doring, Ralf, Kreysig, Kerstin, Rzepka, Sven, Fruehauf, Peter, Weigert, Andreas
المصدر: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024 25th International Conference on. :1-13 Apr, 2024
Relation: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
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4مؤتمر
المؤلفون: Chacko, Jain, Moeller, Heiner, Kolas, Kshitij Anil, Albrecht, Jan, Rzepka, Sven
المصدر: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024 25th International Conference on. :1-9 Apr, 2024
Relation: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
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5مؤتمر
المؤلفون: Albrecht, Jan, Horn, Tobias, Habenicht, Sonke, Rzepka, Sven
المصدر: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2023 IEEE 25th. :722-726 Dec, 2023
Relation: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
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6مؤتمر
المصدر: 2023 IEEE International Conference on Prognostics and Health Management (ICPHM) Prognostics and Health Management (ICPHM), 2023 IEEE International Conference on. :312-319 Jun, 2023
Relation: 2023 IEEE International Conference on Prognostics and Health Management (ICPHM)
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7مؤتمر
المؤلفون: Dudek, Rainer, Otto, Alexander, Doring, Ralf, Mathew, Anu, Liu, Xing, Rzepka, Sven
المصدر: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2023 24th International Conference on. :1-11 Apr, 2023
Relation: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
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8مؤتمر
المؤلفون: Albrecht, Jan, Rzepka, Sven
المصدر: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2022 IEEE 24th. :759-762 Dec, 2022
Relation: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)
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9مؤتمر
المؤلفون: Moeller, Heiner, Knoll, Heiko, Hille, Pascal, Dudek, Rainer, Rzepka, Sven
المصدر: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) Electronics System-Integration Technology Conference (ESTC), 2022 IEEE 9th. :203-209 Sep, 2022
Relation: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC)
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10مؤتمر
المؤلفون: Moller, Heiner, Dudek, Rainer, Otto, Alexander, Rzepka, Sven
المصدر: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2022 21st IEEE Intersociety Conference on. :1-8 May, 2022
Relation: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)