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1دورية أكاديمية
المؤلفون: F. Münn, R. A. Laun, A. Asmus, R. Bülow, S. Bakir, L. Haralambiev, A. Eisenschenk, S. Kim
المصدر: BMC Musculoskeletal Disorders, Vol 21, Iss 1, Pp 1-5 (2020)
مصطلحات موضوعية: Polytrauma, Fracture, Sensitivity, Hand, Missed, Delayed, Diseases of the musculoskeletal system, RC925-935
وصف الملف: electronic resource
Relation: https://doaj.org/toc/1471-2474
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المؤلفون: Ankit Kaul, Yandong Luo, Xiaochen Peng, Madison Manley, Yuan-Chun Luo, Shimeng Yu, Muhannad S. Bakir
المصدر: IEEE Transactions on Electron Devices. 70:485-492
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المؤلفون: Ting Zheng, Muhannad S. Bakir
المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology. 12:2002-2012
مصطلحات موضوعية: Electrical and Electronic Engineering, Industrial and Manufacturing Engineering, Electronic, Optical and Magnetic Materials
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المؤلفون: Md Obaidul Hossen, Ankit Kaul, Eriko Nurvitadhi, Mondira Deb Pant, Ravi Gutala, Aravind Dasu, Muhannad S. Bakir
المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology. 12:1824-1831
مصطلحات موضوعية: Electrical and Electronic Engineering, Industrial and Manufacturing Engineering, Electronic, Optical and Magnetic Materials
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المؤلفون: Muhannad S. Bakir
المصدر: 2023 International VLSI Symposium on Technology, Systems and Applications (VLSI-TSA/VLSI-DAT).
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::60af618ef67a4385bb3299e0f2920135
https://doi.org/10.1109/vlsi-tsa/vlsi-dat57221.2023.10134195 -
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المؤلفون: Shengtao Yu, Thomas K. Gaylord, Muhannad S. Bakir
المصدر: IEEE Photonics Technology Letters. 34:1023-1025
مصطلحات موضوعية: Electrical and Electronic Engineering, Atomic and Molecular Physics, and Optics, Electronic, Optical and Magnetic Materials
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8دورية أكاديمية
لا يتم عرض هذه النتيجة على الضيوف.
تسجيل الدخول للوصول الكامل. -
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المؤلفون: Sreejith Kochupurackal Rajan, Bharath Ramakrishnan, Husam Alissa, Washington Kim, Christian Belady, Muhannad S Bakir
المصدر: IEEE Access. 10:59259-59269
مصطلحات موضوعية: General Computer Science, General Engineering, General Materials Science, Electrical and Electronic Engineering
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المصدر: Embedded and Fan‐Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces. :261-287
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::eebda3bb24486b61707a35949c5b9712
https://doi.org/10.1002/9781119793908.ch11