المؤلفون: Kim, You-Gwon, Kim, Heon-Su, Kim, Tae-Wan, Ryu, Seoung-Ung, Kim, Hak-Sung, Jang, Yong-Rae, Han, Bongtae, Lee, Jun-Hyeong, Kim, Jin-Kyu

المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :2261-2266 May, 2024

Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

المؤلفون: Ryu, Seong-Ung, Park, Jong-Whi, Ju, Young-Min, Kim, Hak-Sung

المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :2218-2222 May, 2024

Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

المؤلفون: Chen, Yaxiong, Hauck, Torsten, Bharamgonda, Aniket, Dasgupta, Abhijit

المصدر: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024 25th International Conference on. :1-6 Apr, 2024

Relation: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

المؤلفون: Bharamgonda, Aniket, Olatunji, Idowu, Lin, Xiao, Dasgupta, Abhijit, Chen, Yaxiong, Thukral, Varun, Hauck, Torsten

المصدر: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024 25th International Conference on. :1-5 Apr, 2024

Relation: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

المؤلفون: Ismail, A.A., Abu Bakar, M., Jalar, A., Zolkefli, Z.E., Basiron, E., Ilias, M.N.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 14(4):735-742 Apr, 2024

المؤلفون: Vyas, P.P., Alahmer, A., Alavi, S.S., Belhadi, M.E.A., Hamasha, S.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 14(3):406-416 Mar, 2024

المؤلفون: Chiong, Kenny, Sutiono, Sylvia, Kumar, B. Senthil, Miew Wan, Lo, Murali, Sarangapani, HanWen, Zhang, Sig, Kang Sung

المصدر: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2023 IEEE 25th. :221-226 Dec, 2023

Relation: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)

المؤلفون: Ku, Jun Ho, Rajendran, Sri Harini, Jung, Jae Pil

المصدر: 2024 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2024 International Conference on. :309-310 Apr, 2024

Relation: 2024 International Conference on Electronics Packaging (ICEP)

المؤلفون: Jo, Eunjin, Kim, YehRi, Park, Young-Bae, Kim, Dongjin

المصدر: 2024 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2024 International Conference on. :147-148 Apr, 2024

Relation: 2024 International Conference on Electronics Packaging (ICEP)

المؤلفون: Ghaffarian, Reza, Meilunas, Michael

المصدر: 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2023 22nd IEEE Intersociety Conference on. :1-8 May, 2023

Relation: 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)