المؤلفون: Negishi, Ryo, Saito, Satoshi, Tomatsu, Itsuro

المصدر: 2024 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2024 International Conference on. :83-84 Apr, 2024

Relation: 2024 International Conference on Electronics Packaging (ICEP)

المؤلفون: Yonezawa, R., Yu, K., Aizawa, H., Suzuki, H., Wajda, C., Leusink, G.

المصدر: 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM) Advanced Metallization Conference (MAM)(IITC/MAM), 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for. :1-3 May, 2023

Relation: 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM)

المؤلفون: Pedreira, O. Varela, Simons, V., van der Veen, M.H, Ciofi, I., Park, S., Tokei, Zs., Croes, K., Pethe, S., Lei, W., Hwang, S., Wu, Z., Chen, F., Jansen, A., Machillot, J., Cockburn, A.

المصدر: 2022 IEEE International Interconnect Technology Conference (IITC) Interconnect Technology Conference (IITC), 2022 IEEE International. :31-33 Jun, 2022

Relation: 2022 IEEE International Interconnect Technology Conference (IITC)

المؤلفون: Negishi, Ryo, Saito, Satoshi, Tomatsu, Itsuro

المصدر: 2023 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2023 International Conference on. :9-10 Apr, 2023

Relation: 2023 International Conference on Electronics Packaging (ICEP)

المؤلفون: Demaude, A.^{Aff1, IDs11090023103556_cor1}, Petitjean, D., Brabant, M., Gordon, M. J., Reniers, F.

المصدر: Plasma Chemistry and Plasma Processing. 43(6):1731-1748

المؤلفون: Bagochus, Evgeniy K., Kichay, Vadim N., Prinz, Victor Ya.

المصدر: 2021 IEEE 22nd International Conference of Young Professionals in Electron Devices and Materials (EDM) Young Professionals in Electron Devices and Materials (EDM), 2021 IEEE 22nd International Conference of. :75-78 Jun, 2021

Relation: 2021 IEEE 22nd International Conference of Young Professionals in Electron Devices and Materials (EDM)

المؤلفون: Inoue, F., Iacovo, S., El-Mekki, Z., Kim, S., Struyf, H., Beyne, E.

المصدر: IEEE Electron Device Letters IEEE Electron Device Lett. Electron Device Letters, IEEE. 42(12):1826-1829 Dec, 2021

المؤلفون: Ngoc Van, Tran Thi, Kim, Changsu, Lee, Hojae, Kim, Jiyong^{Aff2, IDs0089402305806y_cor4}, Shong, Bonggeun^{Aff1, IDs0089402305806y_cor5}

المصدر: Journal of Molecular Modeling: Computational Chemistry - Life Science - Advanced Materials - New Methods. 30(1)

المؤلفون: Kim, Jun Hyun, Lee, Ja Yeon, Kim, Eung Soo, Jeong, Myung Yung^{Aff4, IDs43074023000864_cor4}

المصدر: PhotoniX. 4(1)

المؤلفون: Lauren Colbeck Kirby, Jayant K. Lodha, Simon Astley, Dave Skelton, Silvia Armini, Andrew Evans, Anita Brady-Boyd

المصدر: Nanomaterials, Vol 14, Iss 11, p 982 (2024)

مصطلحات موضوعية: self-assembled monolayer, area selective deposition, X-ray photoelectron spectroscopy, perfluorododecyl iodide, defluorination, Chemistry, QD1-999

وصف الملف: electronic resource

Relation: https://www.mdpi.com/2079-4991/14/11/982; https://doaj.org/toc/2079-4991

URL الوصول: https://doaj.org/article/d75a39f502734fdabdc975a3751ab7df