يعرض 1 - 10 نتائج من 18,469 نتيجة بحث عن '"SINKS"', وقت الاستعلام: 0.86s تنقيح النتائج
  1. 1
    دورية أكاديمية
    Enhanced Thermal and Mechanical Performance in Insulated Aramid/Functionalized Graphene Composite

    المؤلفون: Fan, X., Zhang, W., Wang, H., Li, C., Yu, X., Fan, S., Lv, F.

    المصدر: IEEE Transactions on Dielectrics and Electrical Insulation IEEE Trans. Dielect. Electr. Insul. Dielectrics and Electrical Insulation, IEEE Transactions on. 31(4):1805-1814 Aug, 2024

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  2. 2
    دورية أكاديمية
    Identification of Microchannel Flow Boiling Regimes With Pt Thin-Film Impedance Sensors

    المؤلفون: Schepperle, M., Woias, P.

    المصدر: IEEE Sensors Journal IEEE Sensors J. Sensors Journal, IEEE. 24(14):22843-22854 Jul, 2024

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  3. 3
    مؤتمر
    Tailoring Metaheuristics for Designing Thermodynamic-Optimal Cooling Devices for Microelectronic Thermal Management Applications

    المؤلفون: Perez-Espinosa, Guillermo, Cruz-Duarte, Jorge M., Amaya, Ivan, Ortiz-Bayliss, Jose C., Terashima-Marin, Hugo, Pillay, Nelishia

    المصدر: 2024 IEEE Congress on Evolutionary Computation (CEC) Evolutionary Computation (CEC), 2024 IEEE Congress on. :1-8 Jun, 2024

    Relation: 2024 IEEE Congress on Evolutionary Computation (CEC)

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  4. 4
    مؤتمر
    A General Approach for Maximizing Heat Transfer and Minimizing Capacitance Between MOSFET Configuration and Heat Sink with Thermal Pads

    المؤلفون: Drillings, Benjamin G., Jahnes, Matthew, Preindl, Matthias

    المصدر: 2024 IEEE Transportation Electrification Conference and Expo (ITEC) Transportation Electrification Conference and Expo (ITEC), 2024 IEEE. :1-5 Jun, 2024

    Relation: 2024 IEEE Transportation Electrification Conference and Expo (ITEC)

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  5. 5
    مؤتمر
    Electrical-Thermal Co-analysis of TSV Embedded Microfluidic Pin-fin Heatsink for High Power Dissipation with High Bandwidth Density

    المؤلفون: Chung, Euichul, Yan, Geyu, Ramakrishnan, Bharath, Alissa, Husam, Oruganti, Vaidehi, Belady, Christian, Masselink, Erik W., Bakir, Muhannad S.

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1479-1484 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  6. 6
    مؤتمر
    A flexible composite heat sink embedded Ag microchannels for potential flexible electronic applications

    المؤلفون: Cai, Han, Wu, Yongjin, Xie, DongDong, Luo, Jiangbo, Zhang, Yanxin, Sun, Yunna, Yang, Zhuoqing, Ding, Guifu

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :722-726 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  7. 7
    مؤتمر
    Cross-cut heatsink optimization design by applying Conditional Generative Adversarial Network

    المؤلفون: Kong, Jiaze, Shen, Xiaobing, Sabariego, Ruth V., Martinez, Wilmar

    المصدر: 2024 IEEE 10th International Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia) Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia), 2024 IEEE 10th International. :4155-4160 May, 2024

    Relation: 2024 IEEE 10th International Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia)

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  8. 8
    مؤتمر
    Pre-Feasibility of Water Heat Recovery in an Industrial Building Using an ATES Heat Pump System

    المؤلفون: Benmoussa, Ali, Chater, Nezha, Elfahime, Benaissa

    المصدر: 2024 4th International Conference on Innovative Research in Applied Science, Engineering and Technology (IRASET) Innovative Research in Applied Science, Engineering and Technology (IRASET), 2024 4th International Conference on. :1-4 May, 2024

    Relation: 2024 4th International Conference on Innovative Research in Applied Science, Engineering and Technology (IRASET)

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  9. 9
    مؤتمر
    Orthogonal Rendezvous Multicast for Mobile Sinks in Wireless Sensor Networks

    المؤلفون: Shi, Gaotao, Liu, Zejun, Yang, Jinfeng, Zhao, Zenghua

    المصدر: 2024 27th International Conference on Computer Supported Cooperative Work in Design (CSCWD) Computer Supported Cooperative Work in Design (CSCWD), 2024 27th International Conference on. :1104-1109 May, 2024

    Relation: 2024 27th International Conference on Computer Supported Cooperative Work in Design (CSCWD)

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  10. 10
    مؤتمر
    Optimization of Heat Dissipation Performance of Electronic Device Integration Modules Based on Intelligent Algorithms

    المؤلفون: Liu, Yiming, Wang, Kuo, Yao, Dongxu

    المصدر: 2024 Third International Conference on Distributed Computing and Electrical Circuits and Electronics (ICDCECE) Distributed Computing and Electrical Circuits and Electronics (ICDCECE), 2024 Third International Conference on. :01-05 Apr, 2024

    Relation: 2024 Third International Conference on Distributed Computing and Electrical Circuits and Electronics (ICDCECE)

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