يعرض 1 - 10 نتائج من 399 نتيجة بحث عن '"SLID"', وقت الاستعلام: 0.90s تنقيح النتائج
  1. 1
    مؤتمر
    Low-Temperature Cu–(Sn–Bi) Solid Liquid Interdiffusion Bonding – An Initial Study

    المؤلفون: Gonzalez, Lisette Hernandez, Aasmundveit, Knut E., Nguyen, Hoang-Vu

    المصدر: 2023 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) Microelectronics Packaging (NordPac), 2023 IMAPS Nordic Conference on. :1-4 Jun, 2023

    Relation: 2023 IMAPS Nordic Conference on Microelectronics Packaging (NordPac)

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  2. 2
    مؤتمر
    Exploring Universal Singing Speech Language Identification Using Self-Supervised Learning Based Front-End Features

    المؤلفون: Wang, Xingming, Wu, Hao, Ding, Chen, Huang, Chuanzeng, Li, Ming

    المصدر: ICASSP 2023 - 2023 IEEE International Conference on Acoustics, Speech and Signal Processing (ICASSP) Acoustics, Speech and Signal Processing (ICASSP), ICASSP 2023 - 2023 IEEE International Conference on. :1-5 Jun, 2023

    Relation: ICASSP 2023 - 2023 IEEE International Conference on Acoustics, Speech and Signal Processing (ICASSP)

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  3. 3
    مؤتمر
    Intermetallic Growth Study of Ultra-Thin Copper and Tin Bilayer for Hybrid Bonding Applications

    المؤلفون: Khurana, Gaurav, Panchenko, Iuliana

    المصدر: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :866-871 May, 2023

    Relation: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)

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  4. 4
    مؤتمر
    Solder Joint Reliability of Fully Homogenised SAC-SnBi Low Temperature BGA Interconnections using Solid Liquid Inter-Diffusion (SLID)

    المؤلفون: Ali, Hafiz Waqas, Danovitch, David, Drouin, Dominique, Langlois, Richard, Martel, Robert

    المصدر: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :858-865 May, 2023

    Relation: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)

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  5. 5
    مؤتمر
    Utilizing Co as a contact metallization for wafer-level Cu-Sn-In SLID bonding used in MEMS and MOEMS packaging

    المؤلفون: Emadi, Fahimeh, Vuorinen, Vesa, Paulasto-Krockel, Mervi

    المصدر: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) Electronics System-Integration Technology Conference (ESTC), 2022 IEEE 9th. :359-363 Sep, 2022

    Relation: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC)

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  6. 6
    دورية أكاديمية
    Xpert MTB/XDR assay: rapid TB drug resistance detection

    المؤلفون: Sethi, SunilAff1, IDs15010024022607_cor1, Sharma, Shelly, Aggarwal, Ashutosh N., Dhatwalia, Sunil Kumar, Rana, Rajesh, Yadav, Rakesh

    المصدر: Infection: A Journal of Infectious Diseases. :1-6

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  7. 7
    مؤتمر
    Au-(In-Bi) and Ag-(In-Bi) Metallic Bonding for Temperature Sensitive Materials

    المؤلفون: Nguyen, Hoang-Vu, Kuziora, Stephane Leonard, Aasmundtveit, Knut E.

    المصدر: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) Electronics System-Integration Technology Conference (ESTC), 2022 IEEE 9th. :373-378 Sep, 2022

    Relation: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC)

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  8. 8
    دورية أكاديمية
    A Deep Learning Approach for Identifying and Discriminating Spoken Arabic Among Other Languages

    المؤلفون: Alashban, A.A., Alotaibi, Y.A.

    المصدر: IEEE Access Access, IEEE. 11:11613-11628 2023

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  9. 9
    دورية أكاديمية
    Impact of Inherent Design Limitations for Cu–Sn SLID Microbumps on Its Electromigration Reliability for 3D ICs

    المؤلفون: Tiwary, N., Ross, G., Vuorinen, V., Paulasto-Krockel, M.

    المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 70(1):222-229 Jan, 2023

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  10. 10
    مؤتمر
    Low Temperature Au/Sn Solid-Liquid Diffusion Chip-to-Chip Bonding for MEMS Encapsulation

    المؤلفون: Wenchao, Wang, Liu, Ziyu, Zhiyuan, Zhu, Lin, Chen, Qingqing, Sun

    المصدر: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2022 23rd International Conference on. :1-5 Aug, 2022

    Relation: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT)

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