المؤلفون: Shah, Idris Afzal, Ahmed, Mushtaq, Yadav, Amit

المصدر: 2024 IEEE 9th International Conference for Convergence in Technology (I2CT) Convergence in Technology (I2CT), 2024 IEEE 9th International Conference for. :1-6 Apr, 2024

Relation: 2024 IEEE 9th International Conference for Convergence in Technology (I2CT)

المؤلفون: Ahmed, Mushtaq, Goyal, Saurabh, Singh, Siddhartha, Gupta, Jaiprakash

المصدر: 2019 2nd IEEE Middle East and North Africa COMMunications Conference (MENACOMM) Middle East and North Africa COMMunications Conference (MENACOMM), 2019 2nd IEEE. :1-6 Nov, 2019

Relation: 2019 2nd IEEE Middle East and North Africa COMMunications Conference (MENACOMM)

المؤلفون: Na, Liu, Fei, Luo, Chao, Ding Wei

المصدر: 2019 IEEE Symposium Series on Computational Intelligence (SSCI) Computational Intelligence (SSCI), 2019 IEEE Symposium Series on. :3104-3109 Dec, 2019

Relation: 2019 IEEE Symposium Series on Computational Intelligence (SSCI)

المؤلفون: Kavita, Sahu, Chitrakant, Majumdar, Shubhankar

المصدر: 2019 2nd International Conference on Innovations in Electronics, Signal Processing and Communication (IESC) Innovations in Electronics, Signal Processing and Communication (IESC), 2019 2nd International Conference on. :7-12 Mar, 2019

Relation: 2019 2nd International Conference on Innovations in Electronics, Signal Processing and Communication (IESC)

المؤلفون: Ray, Ruben, Ghoshal, Sagnik, Chanda, Manash

المصدر: 2018 IEEE Electron Devices Kolkata Conference (EDKCON) Electron Devices Kolkata Conference (EDKCON), 2018 IEEE. :614-618 Nov, 2018

Relation: 2018 IEEE Electron Devices Kolkata Conference (EDKCON)

المؤلفون: Ibrahim Talukdar, Md., Sharif Hossen, Md.

المصدر: 2018 International Conference on Innovations in Science, Engineering and Technology (ICISET) Innovations in Science, Engineering and Technology (ICISET), 2018 International Conference on. :407-411 Oct, 2018

Relation: 2018 International Conference on Innovations in Science, Engineering and Technology (ICISET)

المؤلفون: Yubao Cao, Hong Wang, Shuyun Cao, Zaihao Liu, Yanni Zhang

المصدر: Materials, Vol 17, Iss 11, p 2584 (2024)

مصطلحات موضوعية: Cu-doped SNW, shape-preserving, bond strengths, sustained ion release, antibacterial activity, Technology, Electrical engineering. Electronics. Nuclear engineering, TK1-9971, Engineering (General). Civil engineering (General), TA1-2040, Microscopy, QH201-278.5, Descriptive and experimental mechanics, QC120-168.85

وصف الملف: electronic resource

Relation: https://www.mdpi.com/1996-1944/17/11/2584; https://doaj.org/toc/1996-1944

URL الوصول: https://doaj.org/article/fce2f977aaf541b7b92d50233f182ede

المؤلفون: Song, Qianwei, Qin, Bingbin, Tang, Zheng, Liu, Yanguang^{Aff1, Aff2}, Chen, Zhihua^{Aff1, Aff2}, Guo, Jingteng, Xiong, Zhifang^{Aff1, Aff2, IDs1143002199247_cor7}, Li, Tiegang^{Aff1, Aff2, IDs1143002199247_cor8}

المصدر: Science China Earth Sciences. 65(9):1824-1836

المؤلفون: Bhotmange, Tushar, Penurkar, Milind

المصدر: 2015 International Conference on Computing Communication Control and Automation Computing Communication Control and Automation (ICCUBEA), 2015 International Conference on. :315-321 Feb, 2015

Relation: 2015 International Conference on Computing Communication Control and automation(ICCUBEA)

المؤلفون: Miguel Jaramago

المصدر: Boletín del Museo Arqueológico Nacional, Vol 40, Pp 285-304 (2021)

مصطلحات موضوعية: iuty, oro del honor, jefe de los médicos, reino nuevo, antiguo egipto, collarshebiu, ofrendas-snw, paleografía, post-amarna, History of the arts, NX440-632, Museums. Collectors and collecting, AM1-501

وصف الملف: electronic resource

Relation: http://www.man.es/man/dam/jcr:819ab063-7b8d-46eb-9dcb-8dd364564871/2021-bolman-40-16-jaramago.pdf; https://doaj.org/toc/2341-3409

URL الوصول: https://doaj.org/article/8f50f3b5241a4e4ba3a19ee72c58882e