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1دورية أكاديمية
المؤلفون: Garbuglia, F., Spina, D., Deschrijver, D., Couckuyt, I., Dhaene, T.
المصدر: IEEE Transactions on Microwave Theory and Techniques IEEE Trans. Microwave Theory Techn. Microwave Theory and Techniques, IEEE Transactions on. 71(6):2311-2318 Jun, 2023
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2دورية أكاديمية
المؤلفون: Toscani, N., Wu, X., Spina, D., Ginste, D.V., Grassi, F.
المصدر: IEEE Transactions on Electromagnetic Compatibility IEEE Trans. Electromagn. Compat. Electromagnetic Compatibility, IEEE Transactions on. 65(1):126-137 Feb, 2023
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3دورية أكاديمية
المؤلفون: Pugliese, E., Locatelli, M., Bocchi, F., Poggi, P., Jafrancesco, D., Falzone, G., Signorini, N., Spina, D., Meucci, R.
المصدر: IEEE Transactions on Geoscience and Remote Sensing IEEE Trans. Geosci. Remote Sensing Geoscience and Remote Sensing, IEEE Transactions on. 61:1-7 2023
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4دورية أكاديمية
المؤلفون: Ye, Y., Ullrick, T., Bogaerts, W., Dhaene, T., Spina, D.
المصدر: Journal of Lightwave Technology J. Lightwave Technol. Lightwave Technology, Journal of. 40(24):7856-7868 Dec, 2022
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5دورية أكاديمية
المؤلفون: De Ridder, S., Spina, D., Toscani, N., Grassi, F., Ginste, D.V., Dhaene, T.
المصدر: IEEE Transactions on Electromagnetic Compatibility IEEE Trans. Electromagn. Compat. Electromagnetic Compatibility, IEEE Transactions on. 62(6):2538-2546 Dec, 2020
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6دورية أكاديمية
المؤلفون: Belforte, P., Spina, D., Lombardi, L., Antonini, G., Dhaene, T.
المصدر: IEEE Transactions on Circuits and Systems I: Regular Papers IEEE Trans. Circuits Syst. I Circuits and Systems I: Regular Papers, IEEE Transactions on. 67(1):235-248 Jan, 2020
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7دورية أكاديمية
المؤلفون: Kan, D., Spina, D., De Ridder, S., Grassi, F., Rogier, H., Ginste, D.V.
المصدر: IEEE Antennas and Wireless Propagation Letters Antennas Wirel. Propag. Lett. Antennas and Wireless Propagation Letters, IEEE. 18(11):2292-2296 Nov, 2019
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8دورية أكاديمية
المؤلفون: Ye, Y., Wang, M., Spina, D., Bogaerts, W., Dhaene, T.
المصدر: Journal of Lightwave Technology J. Lightwave Technol. Lightwave Technology, Journal of. 37(21):5561-5570 Nov, 2019
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9دورية أكاديمية
المؤلفون: Medico, R., Spina, D., Vande Ginste, D., Deschrijver, D., Dhaene, T.
المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 9(9):1712-1720 Sep, 2019
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10كتاب إلكتروني
المؤلفون: Cinque, D.Aff10, Spina, D.Aff11, Capua, R.Aff12, Antonetti, D.Aff12, Gabriele, S.Aff10
المساهمون: di Prisco, Marco, Series EditorAff1, Chen, Sheng-Hong, Series EditorAff2, Vayas, Ioannis, Series EditorAff3, Kumar Shukla, Sanjay, Series EditorAff4, Sharma, Anuj, Series EditorAff5, Kumar, Nagesh, Series EditorAff6, Wang, Chien Ming, Series EditorAff7, Rizzo, Piervincenzo, editorAff8, Milazzo, Alberto, editorAff9
المصدر: European Workshop on Structural Health Monitoring : EWSHM 2022 - Volume 1. 253:61-70
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