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1مؤتمر
المؤلفون: Al Ahsan, Mohammad, Hasan, S M Kamrul, Chakraborty, Souvik, Suhling, Jeffrey C., Lall, Pradeep
المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1460-1467 May, 2024
Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
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2مؤتمر
المؤلفون: Lall, Pradeep, Mehta, Vishal, Saha, Mrinmoy, Suhling, Jeff, Locker, David
المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1530-1537 May, 2024
Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
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3دورية أكاديمية
المصدر: Journal of Applied Physics; 7/14/2024, Vol. 136 Issue 2, p1-14, 14p
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4دورية أكاديمية
المؤلفون: Li, Fan, Han, Lina, Wang, Xuejiao, Lan, Aidong, Qiao, Junwei
المصدر: Journal of Applied Physics; 5/28/2024, Vol. 135 Issue 20, p1-13, 13p
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5دورية أكاديمية
المؤلفون: Zhan, X., Sun, J., Liu, Y., Cecchi, N.J., Le Flao, E., Gevaert, O., Zeineh, M.M., Camarillo, D.B.
المصدر: IEEE Sensors Journal IEEE Sensors J. Sensors Journal, IEEE. 24(5):7097-7106 Mar, 2024
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6مؤتمر
المؤلفون: Shen, Ziyi, Su, Yutai, Liang, Zhiyuan, Long, Xu
المصدر: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2023 IEEE 25th. :747-750 Dec, 2023
Relation: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
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7دورية أكاديمية
المؤلفون: Tang, Canlian, Gan, Bo, Zhuang, Yukai, Gao, Zhipeng, Zhang, Youjun
المصدر: Journal of Applied Physics; 4/21/2024, Vol. 135 Issue 15, p1-12, 12p
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8دورية أكاديمية
المؤلفون: Moussavi, Arman, Pal, Subhadeep, Wu, Zhenghao, Keten, Sinan
المصدر: Journal of Chemical Physics; 4/7/2024, Vol. 160 Issue 13, p1-13, 13p
مصطلحات موضوعية: MECHANICAL behavior of materials, MODULUS of rigidity, NANOPARTICLES, NANOPARTICLE size, STRAIN rate
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9مؤتمر
المؤلفون: Obara, Yu, Mori, Shohei, Iwai-Takano, Masumi, Arakawa, Mototaka, Kanai, Hiroshi
المصدر: 2023 IEEE International Ultrasonics Symposium (IUS) Ultrasonics Symposium (IUS), 2023 IEEE International. :1-4 Sep, 2023
Relation: 2023 IEEE International Ultrasonics Symposium (IUS)
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10دورية أكاديمية
المؤلفون: Zeng, Y., Cronin, D., Montesano, J.Aff1, IDs40870024004199_cor3
المصدر: Journal of Dynamic Behavior of Materials. :1-18