يعرض 1 - 10 نتائج من 12,655 نتيجة بحث عن '"SURFACE FINISHING"', وقت الاستعلام: 0.82s تنقيح النتائج
  1. 1
    دورية أكاديمية
    Analysis of Topography, Flexural Strength, and Microstructure of a Lithium Disilicate Glass-Ceramic After Surface Finishing.

    المؤلفون: Furini, Giordana Picolo, Pecho, Oscar E., Álvarez-Lloret, Pedro, Benetti, Paula

    المصدر: International Journal of Prosthodontics; 2024, Vol. 37 Issue 4, p439-446, 8p

    مصطلحات موضوعية: FLEXURAL strength testing, FLEXURAL strength, SURFACE finishing, SURFACE roughness, DIFFRACTION patterns

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  2. 2
    مؤتمر
    Ultra-thin Double Side SiP Technology with Embedded Trace Substrate

    المؤلفون: Li, Jerry Che-Han, Belonio, Jesus Mennen, Tang, Humi Shih-Wen, Wei, Jessie Yu-Shan

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1277-1281 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  3. 3
    مؤتمر
    Influences on the Mechanical Strength of Inkjet-Printed, Ag-Nanoparticle-Based Interconnects of Fine-Pitch Components

    المؤلفون: Voigt, Christian, Dornheim, Johannes, Muth, Alexander, Petersen, Matthias, Thielen, Nils, Franke, Jorg

    المصدر: 2024 47th International Spring Seminar on Electronics Technology (ISSE) Electronics Technology (ISSE), 2024 47th International Spring Seminar on. 2024:1-6 May, 2024

    Relation: 2024 47th International Spring Seminar on Electronics Technology (ISSE)

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  4. 4
    مؤتمر
    Effect of New Types of PCB Surface Finishes on Fractographic Morphology of Solder Joints

    المؤلفون: Dzivy, Daniel, Pietrikova, Alena, Hornak, Peter

    المصدر: 2024 47th International Spring Seminar on Electronics Technology (ISSE) Electronics Technology (ISSE), 2024 47th International Spring Seminar on. 2024:1-4 May, 2024

    Relation: 2024 47th International Spring Seminar on Electronics Technology (ISSE)

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  5. 5
    مؤتمر
    Influence of Reflow Temperature Profile on the Intermetallic Layers Thickness at Different Surface Finishes

    المؤلفون: Dusek, Karel, Vesely, Petr, Busek, David, Fros, Denis, Kralova, Iva, Klimtova, Marketa, Pilnaj, Dominik, Uricar, Jonas, Plachy, Zbynek, Sorokina, Kristina, Hintermuller, Jan, Dayoub, Ali, Medgyes, Balint, Krammer, Oliver, Geczy, Attila, Illes, Balazs

    المصدر: 2024 47th International Spring Seminar on Electronics Technology (ISSE) Electronics Technology (ISSE), 2024 47th International Spring Seminar on. 2024:1-4 May, 2024

    Relation: 2024 47th International Spring Seminar on Electronics Technology (ISSE)

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  6. 6
    مؤتمر
    Research on the Application of Composite Cycle G71 in Different CNC System Lathes

    المؤلفون: Xu, Jing

    المصدر: 2024 International Conference on Electrical Drives, Power Electronics & Engineering (EDPEE) EDPEE Electrical Drives, Power Electronics & Engineering (EDPEE), 2024 International Conference on. :162-165 Feb, 2024

    Relation: 2024 International Conference on Electrical Drives, Power Electronics & Engineering (EDPEE)

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  7. 7
    دورية أكاديمية
    Influence of Different Surface Finishing Protocols on the Wear Behavior of Lithium Disilicate Glass-Ceramics.

    المؤلفون: Weber, Katia R., Satpathy, Megha, Marocho, Susana Salazar, Griggs, Jason A., Borba, Márcia

    المصدر: International Journal of Prosthodontics; 2024, Vol. 37 Issue 3, p293-299, 7p

    مصطلحات موضوعية: SURFACE finishing, GLASS-ceramics, SURFACE roughness, SURFACE analysis, SURFACE preparation

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  8. 8
    دورية أكاديمية
    Traceback Analysis of Unknown Nanoparticles Formation Mechanism on OSP Surface Finished PCB for Flip-Chip Package

    المؤلفون: Kim, H., Kim, J., Chu, Y., Jekal, S., Sa, M., Kim, C., Park, G., Lim, J., Otgonbayar, Z., Yoon, C.

    المصدر: IEEE Access Access, IEEE. 12:97132-97142 2024

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  9. 9
    مؤتمر
    Analysis of the influences of PCB process tolerances and assembly tolerances on 60 GHz radar sensor for Radar toolkit

    المؤلفون: Tschoban, Christian, Potter, Harald, Becker, Lukas, Perlwitz, Paul, Brockmann, Carsten, Gros, Mike, Ndip, Ivan, Schneider-Ramelow, Martin

    المصدر: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2023 IEEE 25th. :266-272 Dec, 2023

    Relation: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)

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  10. 10
    مؤتمر
    Thermo-Mechanical performance of large body and small ball pitch Flip chip packages using higher layer count substrates with ENEPIG solder pad finish

    المؤلفون: Ramasamy, Anandan, Low, Shin, Ng, Ace, Maloney, Gerry, Shao, Alan

    المصدر: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2023 IEEE 25th. :442-446 Dec, 2023

    Relation: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)

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