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1مؤتمر
المصدر: 2013 IEEE 63rd Electronic Components and Technology Conference Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd. :1794-1799 May, 2013
Relation: 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC)
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2مؤتمر
المصدر: 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2012 IEEE 14th. :174-179 Dec, 2012
Relation: 2012 IEEE 14th Electronics Packaging Technology Conference - (EPTC 2012)
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3مؤتمر
المؤلفون: Saarinen, Kirsi, Frisk, Laura
المصدر: 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2012 IEEE 14th. :180-184 Dec, 2012
Relation: 2012 IEEE 14th Electronics Packaging Technology Conference - (EPTC 2012)
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4مؤتمر
المؤلفون: Saarinen, Kirsi, Frisk, Laura
المصدر: 2012 4th Electronic System-Integration Technology Conference Electronic System-Integration Technology Conference (ESTC), 2012 4th. :1-4 Sep, 2012
Relation: 2012 4th Electronic System-Integration Technology Conference (ESTC)
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5مؤتمر
المؤلفون: Lahokallio, Sanna, Saarinen, Kirsi, Frisk, Laura
المصدر: 18th European Microelectronics & Packaging Conference Microelectronics and Packaging Conference (EMPC), 2011 18th European. :1-6 Sep, 2011
Relation: 2011 18th European Microelectronics and Packaging Conference (EMPC)
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6مؤتمر
المؤلفون: Frisk, Laura, Saarinen, Kirsi, Kokko, Kati
المصدر: 18th European Microelectronics & Packaging Conference Microelectronics and Packaging Conference (EMPC), 2011 18th European. :1-7 Sep, 2011
Relation: 2011 18th European Microelectronics and Packaging Conference (EMPC)
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7مؤتمر
المؤلفون: Saarinen, Kirsi, Frisk, Laura, Ukkonen, Leena
المصدر: 18th European Microelectronics & Packaging Conference Microelectronics and Packaging Conference (EMPC), 2011 18th European. :1-5 Sep, 2011
Relation: 2011 18th European Microelectronics and Packaging Conference (EMPC)
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8مؤتمر
المؤلفون: Saarinen, Kirsi, Frisk, Laura
المصدر: 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2012 13th International Conference on. :1/8-8/8 Apr, 2012
Relation: 2012 13th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
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9دورية أكاديمية
المؤلفون: Saarinen, Kirsi, Heino, Pekka
المصدر: Soldering & Surface Mount Technology, 2010, Vol. 22, Issue 1, pp. 41-46.
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10دورية أكاديمية
المؤلفون: Lahokallio, Sanna, Saarinen, Kirsi, Frisk, Laura
المصدر: Journal of Electronic Materials. September 2013 42(9):2822-2834
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