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المؤلفون: Esref Turkmen, Conrad Zerna, Hamza Kandis, Ramona Hotopan, Wojciech Debski, Sabine Scherbaum, Arndt Ott, Leonardo Govoni, Andreas Drost, Roger Frederick Dupont, Johann Josef Balbach-Sobkowicz
المصدر: 2022 24th International Microwave and Radar Conference (MIKON).
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::4dbdb48f548c490c5b2d1160f311c814
https://doi.org/10.23919/mikon54314.2022.9924731 -
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المؤلفون: Christof Landesberger, Thomas Velten, F. Bauerfeld, Karlheinz Bock, Sabine Scherbaum, H. Schuck
المصدر: Microsystem Technologies. 17:619-627
مصطلحات موضوعية: Engineering drawing, Materials science, Silicon, business.industry, chemistry.chemical_element, Condensed Matter Physics, Electronic, Optical and Magnetic Materials, Roll-to-roll processing, chemistry, Hardware and Architecture, Etching (microfabrication), Optoelectronics, Wafer, Dry etching, Electrical and Electronic Engineering, business, Lithography, Embossing, FOIL method
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المؤلفون: Josef Weber, Karlheinz Bock, Mitsuru Hiroshima, Christof Landesberger, Bernhard Oberhofer, Sabine Scherbaum
المصدر: 2012 4th Electronic System-Integration Technology Conference.
مصطلحات موضوعية: business.product_category, Materials science, Silicon, business.industry, Plasma activation, chemistry.chemical_element, Nanotechnology, Substrate (electronics), Chip, eye diseases, chemistry, Die (manufacturing), Optoelectronics, Wafer dicing, Wetting, Infrared microscopy, business
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::86c3bdda92969ec925078cacb22f6098
https://doi.org/10.1109/estc.2012.6542177 -
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المؤلفون: Karlheinz Bock, Sabine Scherbaum, Christof Landesberger
المصدر: Ultra-thin Chip Technology and Applications ISBN: 9781441972750
مصطلحات موضوعية: Materials science, genetic structures, business.industry, Semiconductor device fabrication, technology, industry, and agriculture, Wafer backgrinding, eye diseases, Wafer fabrication, Die preparation, Optoelectronics, Microelectronics, Wafer testing, Wafer dicing, Wafer, sense organs, business
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::864f86eaec74e09386999f2367361ba4
https://doi.org/10.1007/978-1-4419-7276-7_4 -
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المصدر: 2008 58th Electronic Components and Technology Conference.
مصطلحات موضوعية: Materials science, Silicon, chemistry.chemical_element, Substrate (electronics), engineering.material, Contact angle, chemistry, Coating, engineering, Wetting, Thin film, Composite material, Layer (electronics), Polyimide
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::28ff500b6828e3459948f2083d7412b6
https://doi.org/10.1109/ectc.2008.4550112 -
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المؤلفون: Michael Feil, Sabine Scherbaum, Gerhard Klink, Andreas Drost
المصدر: SPIE Proceedings.
مصطلحات موضوعية: Wire bonding, Materials science, Fabrication, Wafer bonding, Anodic bonding, Borosilicate glass, business.industry, Optoelectronics, Wafer, Thermocompression bonding, business, Electrical contacts
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::85e0b3ff5d7098d517eb3308a96517be
https://doi.org/10.1117/12.323914 -
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المؤلفون: 'Sabine Scherbaum
المصدر: Christof Landesberger
URL الوصول: https://explore.openaire.eu/search/publication?articleId=r3c4b2081b22::2dbe89d890aedcc1e60f3d2b9e64fa5f
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