المؤلفون: Ota, K., Yamaguchi, M., Kabuyanagi, S., Fujii, S., Saitoh, M., Yoshikawa, M.

المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 69(12):7089-7095 Dec, 2022

المؤلفون: Liu, Zongmu^Aff11, Saitoh, M.^Aff12

المساهمون: di Prisco, Marco, Series Editor^Aff1, Chen, Sheng-Hong, Series Editor^Aff2, Vayas, Ioannis, Series Editor^Aff3, Kumar Shukla, Sanjay, Series Editor^Aff4, Sharma, Anuj, Series Editor^Aff5, Kumar, Nagesh, Series Editor^Aff6, Wang, Chien Ming, Series Editor^Aff7, Arthur, Scott, editor^Aff8, Saitoh, Masato, editor^Aff9, Hoque, Asiful, editor^Aff10

المصدر: Proceedings of the 6th International Conference on Advances in Civil Engineering : ICACE 2022. 368:323-335

المؤلفون: Ichihara, R., Fujii, S., Yamaguchi, M., Yoshimura, Y., Mitani, Y., Saitoh, M.

المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 66(5):2165-2171 May, 2019

المؤلفون: Saitoh, M.

المصدر: IEEE Journal of the Electron Devices Society IEEE J. Electron Devices Soc. Electron Devices Society, IEEE Journal of the. 10:860-860 2022

المؤلفون: Saha, A. K.^Aff11, Saitoh, M.^Aff12, Shrestha, N. R.^Aff12, Goit, C. S.^Aff12

المساهمون: di Prisco, Marco, Series Editor^Aff1, Chen, Sheng-Hong, Series Editor^Aff2, Vayas, Ioannis, Series Editor^Aff3, Kumar Shukla, Sanjay, Series Editor^Aff4, Sharma, Anuj, Series Editor^Aff5, Kumar, Nagesh, Series Editor^Aff6, Wang, Chien Ming, Series Editor^Aff7, Arthur, Scott, editor^Aff8, Saitoh, Masato, editor^Aff9, Pal, Sudip Kumar, editor^Aff10

المصدر: Advances in Civil Engineering : Select Proceedings of ICACE 2020. 184:73-80

المؤلفون: Kashiwagi, Y., Saitoh, M., Hasegawa, T., Matsukawa, K., Shigemune, T., Koizumi, A., Kojima, T., Fujiwara, Y., Kakiuchi, H., Aoyagi, N., Yoshida, Y., Nakamoto, M.

المصدر: 2016 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2016 International Conference on. :129-132 Apr, 2016

Relation: 2016 International Conference on Electronics Packaging (ICEP)

المؤلفون: Ota, K., Yamaguchi, M., Berdan, R., Marukame, T., Nishi, Y., Matsuo, K., Takahashi, K., Kamiya, Y., Miyano, S., Deguchi, J., Fujii, S., Saitoh, M.

المصدر: 2019 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2019 IEEE International. :6.2.1-6.2.4 Dec, 2019

Relation: 2019 IEEE International Electron Devices Meeting (IEDM)

المؤلفون: Saitoh, M., Honma, N., Murakami, T.

المصدر: IEEE Antennas and Wireless Propagation Letters Antennas Wirel. Propag. Lett. Antennas and Wireless Propagation Letters, IEEE. 15:666-669 2016

المؤلفون: Zhang, L., Saitoh, M., Koike, M., Takeno, S., Tanimoto, H., Adachi, K., Yasutake, N., Kusunoki, N.

المصدر: 2010 International Workshop on Junction Technology Extended Abstracts Junction Technology (IWJT), 2010 International Workshop on. :1-5 May, 2010

Relation: 2010 International Workshop on Junction Technology (IWJT)

المؤلفون: Fujiwara, K., Koide, A., Saitoh, M.

المصدر: IEEE International Conference on e-Business Engineering (ICEBE'05) e-Business Engineering e-Business Engineering, 2005. ICEBE 2005. IEEE International Conference on. :765-768 2005

Relation: IEEE International Conference on e-Business Engineering