المؤلفون: Huttunen, J., Parssinen, M., Heikkila, T., Salmela, O., Manner, J., Pongracz, E.

المصدر: IEEE Access Access, IEEE. 11:2863-2874 2023

المؤلفون: Putaala, J., Hagberg, J., Kangasvieri, T., Raumanni, J., Salmela, O., Rahko, M., Jaaskelainen, J., Galkin, T., Nousiainen, O., Jantunen, H.

المصدر: IEEE Transactions on Device and Materials Reliability IEEE Trans. Device Mater. Relib. Device and Materials Reliability, IEEE Transactions on. 19(3):484-493 Sep, 2019

المؤلفون: Hagberg, J., Putaala, J., Raumanni, J., Salmela, O., Galkin, T.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 7(10):1634-1643 Oct, 2017

المؤلفون: Andersson, K., Salmela, O., Perttula, A., Sarkka, J., Tammenmaa, M.

المصدر: EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. Thermal mechanical and multi-physics simulation and experiments in micro-electronics and micro-syste Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. EuroSimE 2005. Proceedings of the 6th International Conference on. :448-453 2005

Relation: Thermal Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems

المؤلفون: Putaala, J., Salmela, O., Nousiainen, O., Kangasvieri, T., Uusimaki, A.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 2(6):994-1001 Jun, 2012

المؤلفون: Salmela, O., Nieminen, T., SÄrkkÄ, J., Tammenmaa, M.

المصدر: IEEE Transactions on Components and Packaging Technologies IEEE Trans. Comp. Packag. Technol. Components and Packaging Technologies, IEEE Transactions on. 31(1):13-22 Mar, 2008

المؤلفون: Salmela, O.

المصدر: IEEE Transactions on Components and Packaging Technologies IEEE Trans. Comp. Packag. Technol. Components and Packaging Technologies, IEEE Transactions on. 30(4):700-707 Dec, 2007

المؤلفون: Salmela, O., Ikalainen, P.

المصدر: Proceedings of 1997 Wireless Communications Conference Wireless communications Wireless Communications Conference, 1997., Proceedings. :162-164 1997

Relation: Proceedings of 1997 Wireless Communications Conference

المؤلفون: Ikkala, O.T., Jaarinen, J.P., Lindholm, T.M., Taka, T., Salmela, O., Vakiparta, K.

المصدر: International Conference on Science and Technology of Synthetic Metals Science and Technology of Synthetic Metals, 1994. ICSM '94. International Conference on. :336-336 1994

Relation: International Conference on Science and Technology of Synthetic Metals

المؤلفون: Nousiainen, O., Salmela, O., Putaala, J., Kangasvieri, T.

المصدر: Soldering & Surface Mount Technology, 2011, Vol. 23, Issue 2, pp. 104-114.

URL الوصول: http://www.emeraldinsight.com/doi/10.1108/09540911111120177