المؤلفون: Anthony Agnesina, Moritz Brunion, Alberto Garcia-Ortiz, Francky Catthoor, Dragomir Milojevic, Manu Komalan, Matheus Cavalcante, Samuel Riedel, Luca Benini, Sung Kyu Lim

المساهمون: Li, Helen, Augustine, Charles, Kivilcim Coskun, Ayse, Ghosh, Swaroop

المصدر: ISLPED '22: Proceedings of the ACM/IEEE International Symposium on Low Power Electronics and Design

مصطلحات موضوعية: Hier-3D, Physical Design Methodology, Wafer-level Bonding, Faceto-Face (F2F) Bonded 3D ICs

وصف الملف: application/application/pdf

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::b9a8410be98cb3b7fcfe5b927b995811
https://doi.org/10.1145/3531437.3539702

المؤلفون: Matheus Cavalcante, Anthony Agnesina, Samuel Riedel, Moritz Brunion, Alberto Garcia-Ortiz, Dragomir Milojevic, Francky Catthoor, Sung Kyu Lim, Luca Benini

المساهمون: Bolchini, C, Verbauwhede, I, Vatajelu, I

مصطلحات موضوعية: FOS: Computer and information sciences, Technology, Science & Technology, Engineering, Electrical & Electronic, Computer Science, Software Engineering, Many-core, Automation & Control Systems, Engineering, DESIGN, 3D-ICs, Hardware Architecture (cs.AR), Engineering, Industrial, Computer Science, 3D Integration, Computer Science - Hardware Architecture, Computer Science, Hardware & Architecture

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::1b84e777b63c8a1f1d77f36b071a3bcc
https://lirias.kuleuven.be/handle/20.500.12942/702411

المؤلفون: Matheus Cavalcante, Domenic Wüthrich, Matteo Perotti, Samuel Riedel, Luca Benini

مصطلحات موضوعية: FOS: Computer and information sciences, C.1.3, C.1.2, Hardware Architecture (cs.AR), Computer Science - Hardware Architecture

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::939762ec260966648bddb738ba2ef84b

المؤلفون: Matheus Cavalcante, Luca Benini, Samuel Riedel, Antonio Pullini

المساهمون: Cavalcante M., Riedel S., Pullini A., Benini L.

المصدر: DATE

مصطلحات موضوعية: FOS: Computer and information sciences, Multi-core processor, business.industry, Computer science, MIMD, Network topology, Many-core, Memory management, Memory bank, Embedded system, Hardware Architecture (cs.AR), Latency (engineering), Networks-on-Chips, Computer Science - Hardware Architecture, business, Throughput (business), Scratchpad memory

وصف الملف: ELETTRONICO

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::d9abe0325d0c5d8aa22df2340a4afed3
https://doi.org/10.23919/date51398.2021.9474087

المؤلفون: Andreas Kurth, Torsten Hoefler, Luca Benini, Samuel Riedel, Florian Zaruba

المساهمون: Kurth A., Riedel S., Zaruba F., Hoefler T., Benini L.

المصدر: 2020 57th ACM/IEEE Design Automation Conference (DAC)
DAC

مصطلحات موضوعية: 020203 distributed computing, Memory hierarchy, Computer science, business.industry, open-source ATomic UNit (ATUN), highly-scalable manycore processors, 02 engineering and technology, Parallel computing, Modular design, Atomic units, 020202 computer hardware & architecture, Scalability, Atomic operations, 0202 electrical engineering, electronic engineering, information engineering, business, Critical path method, FPGA prototype

وصف الملف: ELETTRONICO

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::dd43f100983697e256d143f92cdc57e8
https://hdl.handle.net/20.500.11850/496346