يعرض 1 - 10 نتائج من 51 نتيجة بحث عن '"Sardi, Giovanni Maria"', وقت الاستعلام: 1.07s تنقيح النتائج
  1. 1
    مؤتمر

    المصدر: 2024 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2024 Symposium on. :1-4 Jun, 2024

    Relation: 2024 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)

  2. 2
    مؤتمر

    المصدر: 2023 Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP) Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP), 2023 Symposium on. :1-4 May, 2023

    Relation: 2023 Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP)

  3. 3
    مؤتمر

    المصدر: 2022 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2022 Symposium on. :1-5 Jul, 2022

    Relation: 2022 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)

  4. 4
    كتاب إلكتروني

    المؤلفون: Proietti, EmanuelaAff14, Capoccia, GiovanniAff14, Marcelli, RomoloAff14, Sardi, Giovanni MariaAff14, Caponera, BarbaraAff14, Aff15

    المساهمون: Chaari, Fakher, Series EditorAff1, Gherardini, Francesco, Series EditorAff2, Aff12, Ivanov, Vitalii, Series EditorAff3, Cavas-Martínez, Francisco, Editorial Board MemberAff4, di Mare, Francesca, Editorial Board MemberAff5, Haddar, Mohamed, Editorial Board MemberAff6, Kwon, Young W., Editorial Board MemberAff7, Trojanowska, Justyna, Editorial Board MemberAff8, Furferi, Rocco, editorAff9, Governi, Lapo, editorAff10, Volpe, Yary, editorAff11, Seymour, Kate, editorAff13

    المصدر: The Future of Heritage Science and Technologies : Design, Simulation and Monitoring. :392-400

  5. 5
    مؤتمر

    المصدر: 2018 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP), 2018 Symposium on. :1-4 May, 2018

    Relation: 2018 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP)

  6. 6
    مؤتمر

    المصدر: 2017 International Semiconductor Conference (CAS) Semiconductor Conference (CAS), 2017 International. :29-36 Oct, 2017

    Relation: 2017 International Semiconductor Conference (CAS)

  7. 7
    دورية أكاديمية
  8. 8
    مؤتمر

    المصدر: 2017 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2017 Symposium on. :1-4 May, 2017

    Relation: 2017 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)

  9. 9
    مؤتمر

    المصدر: 2017 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2017 Symposium on. :1-4 May, 2017

    Relation: 2017 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)

  10. 10
    دورية أكاديمية