المؤلفون: Martin, Henry A., Xu, Haojia, Smits, Edsger C.P., van Driel, Willem D., Zhang, GuoQi

المصدر: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024 25th International Conference on. :1-7 Apr, 2024

Relation: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

المؤلفون: Lafrance, Samantha, Bernadin, Shonda

المصدر: SoutheastCon 2024 SoutheastCon, 2024. :1250-1255 Mar, 2024

Relation: SoutheastCon 2024

المؤلفون: Singh, Himanshu, Agarwal, Komal, Ahmad, Azeem, Shukla, Kaushik, Wagle, Sanat, Melandso, Frank, Habib, Anowarul

المصدر: 2023 IEEE International Ultrasonics Symposium (IUS) Ultrasonics Symposium (IUS), 2023 IEEE International. :1-4 Sep, 2023

Relation: 2023 IEEE International Ultrasonics Symposium (IUS)

المؤلفون: Kupsch, Christian, Wolf, Mario

المصدر: 2023 IEEE International Ultrasonics Symposium (IUS) Ultrasonics Symposium (IUS), 2023 IEEE International. :1-4 Sep, 2023

Relation: 2023 IEEE International Ultrasonics Symposium (IUS)

المؤلفون: Schmid, M., Zippelius, A., Hans, A., Bockhorst, S., Elger, G.

المصدر: IEEE Transactions on Device and Materials Reliability IEEE Trans. Device Mater. Relib. Device and Materials Reliability, IEEE Transactions on. 23(3):419-429 Sep, 2023

المؤلفون: Sundblad, Felix, Hyvonen, Jere, Holmstrom, Axi, Salmi, Ari, Haeggstrom, Edward

المصدر: 2022 IEEE International Ultrasonics Symposium (IUS) Ultrasonics Symposium (IUS), 2022 IEEE International. :1-4 Oct, 2022

Relation: 2022 IEEE International Ultrasonics Symposium (IUS)

المؤلفون: Wolf, Mario, Hoffrogge, Peter, Kuhnicke, Elfgard, Czurratis, Peter, Kupsch, Christian

المصدر: 2022 IEEE International Ultrasonics Symposium (IUS) Ultrasonics Symposium (IUS), 2022 IEEE International. :1-4 Oct, 2022

Relation: 2022 IEEE International Ultrasonics Symposium (IUS)

المؤلفون: Hermann, Joseph, Schmid, Maximilian, Elger, Gordon

المصدر: 2022 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Thermal Investigations of ICs and Systems (THERMINIC), 2022 28th International Workshop on. :1-6 Sep, 2022

Relation: 2022 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)

المؤلفون: Zippelius, Andreas, Strobl, Tobias, Schmid, Maximilian, Hermann, Joseph, Hoffmann, Alwin, Elger, Gordon

المصدر: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) Electronics System-Integration Technology Conference (ESTC), 2022 IEEE 9th. :566-575 Sep, 2022

Relation: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC)

المؤلفون: Schmid, Maximilian, Hermann, Joseph, Liu, E, Elger, Gordon

المصدر: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2022 21st IEEE Intersociety Conference on. :1-6 May, 2022

Relation: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)