يعرض 1 - 6 نتائج من 6 نتيجة بحث عن '"Schipfer, Christian"', وقت الاستعلام: 1.07s تنقيح النتائج
  1. 1
    مؤتمر
    A comprehensive methodology for criticality assessment of microvias in printed circuit board assemblies

    المؤلفون: Kamble, Vikram G, Patel, Dhaval Rasheshkumar, Schipfer, Christian, Thalhamer, Andreas, Zuendel, Julia, Krivec, Thomas, Antretter, Thomas, Fuchs, Peter Filipp

    المصدر: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024 25th International Conference on. :1-7 Apr, 2024

    Relation: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

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  2. 2
    مؤتمر
    Prediction of thermo-mechanical properties of PCB conductive layers using convolutional neural networks

    المؤلفون: Shevchuk, Mariia, Schipfer, Christian, Haselmann, Matthias, Tao, Qi, Fuchs, Peter

    المصدر: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2023 24th International Conference on. :1-6 Apr, 2023

    Relation: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

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  3. 3
    مؤتمر
    Pressing Simulations within the PCB Manufacturing Framework

    المؤلفون: Schipfer, Christian, Fuchs, Peter, Morak, Matthias, Tao, Qi, Zuendel, Julia

    المصدر: 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2022 23rd International Conference on. :1-5 Apr, 2022

    Relation: 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

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  4. 4
    مؤتمر
    Prediction of Curing Induced Residual Stresses in Polymeric Encapsulation Materials for Microelectronics

    المؤلفون: Schipfer, Christian, Gschwandl, Mario, Fuchs, Peter, Antretter, Thomas, Feuchter, Michael, Morak, Matthias, Tao, Qi, Schingale, Angelika

    المصدر: 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2021 22nd International Conference on. :1-8 Apr, 2021

    Relation: 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

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  5. 5
    دورية أكاديمية
    Tactile friction and perception of UV-curable coatings and their relation to physical surface parameters and contact mechanic simulation

    المؤلفون: Ules, ThomasAff1, IDs11998023007925_cor1, Grießer, Michael, Hausberger, Andreas, Schipfer, Christian, Mansouri, Mohammad, Fuchs, Peter, Schlögl, Sandra, Gruber, Dieter P.

    المصدر: Journal of Coatings Technology and Research. 20(6):1803-1814

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  6. 6
    دورية أكاديمية
    Towards virtually optimized curing cycles for polymeric encapsulations in microelectronics

    المؤلفون: Schipfer, Christian, Gschwandl, Mario, Fuchs, Peter, Antretter, Thomas, Feuchter, Michael, Morak, Matthias, Tao, Qi, Schingale, Angelika

    المصدر: In Microelectronics Reliability December 2022 139

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