المؤلفون: Manessis, D., Schischke, K., Pawlikowski, J., Krivec, T., Schulz, G., Podhradsky, G., Aschenbrenner, R., Schneider-Ramelow, M., Ostmann, A., Lang, K-D.

المصدر: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) European Microelectronics and Packaging Conference & Exhibition (EMPC), 2019 22nd. :1-8 Sep, 2019

Relation: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC)

المؤلفون: Manessis, D., Pawlikowski, J., Ostmann, A., Schischke, K., Aschenbrenner, R., Schneider-Ramelow, M., Krivec, T., Podhradsky, G., Lang, K-D.

المصدر: 2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition Microelectronics and Packaging Conference (EMPC) & Exhibition, 2017 21st European. :1-8 Sep, 2017

Relation: 2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition

المؤلفون: Schischke, K., Mueller, J., Reichl, H.

المصدر: Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment, 2006. Electronics and the Environment, 2006. Proceedings of the 2006 IEEE International Symposium on. :233-238 2006

Relation: 2006 IEEE International Symposium on Electronics and the Environment

المؤلفون: Schischke, K., Griese, H., Mueller, J., Stobbe, I.

المصدر: Proceedings of 2005 International Conference on Asian Green Electronics, 2005. AGEC. Asian Green Electronics Asian Green Electronics, 2005. AGEC. Proceedings of 2005 International Conference on. :25-30 2005

Relation: Proceedings of 2005 International Conference on Asian Green Electronics

المؤلفون: Mueller, J., Griese, H., Schischke, K., Stobbe, L.

المصدر: Proceedings of 2005 International Conference on Asian Green Electronics, 2005. AGEC. Asian Green Electronics Asian Green Electronics, 2005. AGEC. Proceedings of 2005 International Conference on. :33-36 2005

Relation: Proceedings of 2005 International Conference on Asian Green Electronics

المؤلفون: Schischke, K., Middendorf, A., Reichl, H., Griese, H., Kasper, M., Ong, K.

المصدر: Proceedings of the 2005 IEEE International Symposium on Electronics and the Environment, 2005. Electronics and the environment Electronics and the Environment, 2005. Proceedings of the 2005 IEEE International Symposium on. :13-18 2005

Relation: Proceedings of the 2005 IEEE International Symposium on Electronics and the Environment

المؤلفون: Griese, H., Schischke, K., Reichl, H., Stobbe, L.

المصدر: Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) High density microsystem design and packaging and component failure analysis High Density Microsystem Design and Packaging and Component Failure Analysis, 2004. HDP '04. Proceeding of the Sixth IEEE CPMT Conference on. :154-159 2004

Relation: Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04)

المؤلفون: Griese, H., Poetter, H., Schischke, K., Ness, O., Reichl, H.

المصدر: IEEE International Symposium on Electronics and the Environment, 2004. Conference Record. 2004 Electronics and the environment Electronics and the Environment, 2004. Conference Record. 2004 IEEE International Symposium on. :173-178 2004

Relation: Proceedings of the 2004 IEEE International Symposium on Electronics and the Environment

المؤلفون: Schischke, K., Pandey, U.C., Sethi, V.C., Griese, H., Reichl, H.

المصدر: 2004 International IEEE Conference on the Asian Green Electronics (AGEC). Proceedings of Asian green electronics Asian Green Electronics, 2004. AGEC. Proceedings of 2004 International IEEE Conference on the. :150-157 2004

Relation: Proceedings of 2004 International IEEE Conference on the Asian Green Electronics (AGEC)

المؤلفون: Mueller, J., Griese, H., Schischke, K., Stobbe, I., Norris, G.A., Udo de Haes, A.

المصدر: 2004 International IEEE Conference on the Asian Green Electronics (AGEC). Proceedings of Asian green electronics Asian Green Electronics, 2004. AGEC. Proceedings of 2004 International IEEE Conference on the. :193-199 2004

Relation: Proceedings of 2004 International IEEE Conference on the Asian Green Electronics (AGEC)