المؤلفون: Creamer, C. T., Chu, K. K., Chao, P. C., Schmanski, B., Yurovchak, T., Sweetland, S., Campbell, Geoff, Eppich, Henry, Ohadi, Michael, McCluskey, Patrick

المصدر: 2014 Lester Eastman Conference on High Performance Devices (LEC) Lester Eastman Conference on High Performance Devices (LEC), 2014. :1-5 Aug, 2014

Relation: 2014 Lester Eastman Conference on High Performance Devices (LEC)

المؤلفون: Xu, Dong, Chu, K. K., Diaz, J. A., Pleasant, L. Mt., Lender, R., Schmanski, B., Ashman, M., Hulse, J., Gerlach, M., Zhu, Wenhua, Seekell, P., Schlesinger, L., Isaak, R., Nichols, K., Komiak, J. J., Yang, X. P., Duh, K. H. G., Smith, P. M., Chao, P. C.

المصدر: 2014 Lester Eastman Conference on High Performance Devices (LEC) Lester Eastman Conference on High Performance Devices (LEC), 2014. :1-3 Aug, 2014

Relation: 2014 Lester Eastman Conference on High Performance Devices (LEC)

المؤلفون: Tang, O.S.A., Hwang, K.C., Chao, P.C., Nichols, K., MtPleasant, L., Schmanski, B., Lang, M., Duh, K.H.G., Smith, P.M., Valenti, S., Melcher, R., Taft, W.

المصدر: GaAs IC Symposium. IEEE Gallium Arsenide Integrated Circuits Symposium. 22nd Annual Technical Digest 2000. (Cat. No.00CH37084) GaAs IC symposium GaAs IC Symposium, 2000. 22nd Annual. :147-150 2000

Relation: GaAs IC Symposium IEEE Gallium Arsenide Integrated Circuit Symposium 22nd Annual Technical Digest 2000

المؤلفون: Manohar, S., Jin, Z., Pham, A., Krishnamurthy, V., Bates, D., Marcinkewicz, W., Schmanski, B., Saia, R., Sprinceanu, L.

المصدر: 2000 IEEE MTT-S International Microwave Symposium Digest (Cat. No.00CH37017) Microwave symposium Microwave Symposium Digest. 2000 IEEE MTT-S International. 3:1879-1882 vol.3 2000

Relation: 2000 IEEE MTT-S International Microwave Symposium Digest

المؤلفون: Pham, A., Laskar, J., Krishnamurthy, V., Bates, D., Marcinkewicz, W., Schmanski, B., Piacente, P., Sprinceanu, L.

المصدر: IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.00TH8524) Electrical performance of electronic packaging Electrical Performance of Electronic Packaging, 2000, IEEE Conference on.. :277-280 2000

Relation: IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging

المؤلفون: Xu, D., Kong, W. M. T., Yang, X., Smith, P. M., Dugas, D., Chao, P. C., Cueva, G., Mohnkern, L., Seekell, P., Pleasant, L. M., Schmanski, B., Duh, K. H. G., Karimy, H., Immorlica, A., Komiak, J. J.

المصدر: IEEE Electron Device Letters IEEE Electron Device Lett. Electron Device Letters, IEEE. 29(1):4-7 Jan, 2008

المؤلفون: Pham, A.-V.H., Krishnamurthy, V., Bates, D., Marcinkewicz, W., Schmanski, B., Saia, R., Sprinceanu, L.

المصدر: IEEE Transactions on Advanced Packaging IEEE Trans. Adv. Packag. Advanced Packaging, IEEE Transactions on. 25(1):98-101 Feb, 2002

المؤلفون: Pham, A., Ramachandran, R., Laskar, J., Krishnamurthy, V., Bates, D., Marcinkewicz, W., Schmanski, B., Piacente, P., Sprinceanu, L.

المصدر: IEEE Transactions on Microwave Theory and Techniques IEEE Trans. Microwave Theory Techn. Microwave Theory and Techniques, IEEE Transactions on. 49(10):1747-1749 Oct, 2001

المؤلفون: Dong Xu, Kong, Wendell M. T., Xiaoping Yang, Smith, P. M., Dugas, D., Chao, P. C., Cueva, G., Mohnkern, L., Seekell, P., Pleasant, L. Mt., Schmanski, B., Duh, K. H. G., Karimy, H., Immorlica, A., Komiak, J. J.

المصدر: IEEE Electron Device Letters; Jan2008, Vol. 29 Issue 1, p4-7, 4p, 2 Graphs

مصطلحات موضوعية: MODULATION-doped field-effect transistors, ELECTRON beam lithography, INDUSTRIAL applications of electron beams, MICROELECTRONICS, FIELD-effect transistors, SEMICONDUCTORS