يعرض 1 - 10 نتائج من 76 نتيجة بحث عن '"Schulze, Kyle"', وقت الاستعلام: 0.77s تنقيح النتائج
  1. 1
    مؤتمر
    Process Development for Fabrication of Copper Additive-Multilayer Circuits with Component Attachment using ECA and LTS

    المؤلفون: Lall, Pradeep, Narangaparambil, Jinesh, Schulze, Kyle, Hill, Curtis

    المصدر: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2022 21st IEEE Intersociety Conference on. :1-9 May, 2022

    Relation: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)

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  2. 2
    مؤتمر
    Development and Validation of the Statistical Elastic and Elastic-plastic Rough Surface Contact Model for Small Contact to Complete Contact

    المؤلفون: Saha, Swarna, Xu, Yang, Schulze, Kyle, Jackson, Robert L

    المصدر: 2021 IEEE 66th Holm Conference on Electrical Contacts (HLM) Electrical Contacts (HLM), 2021 IEEE 66th Holm Conference on. :115-122 Oct, 2021

    Relation: 2021 IEEE 66th Holm Conference on Electrical Contacts (HLM)

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  3. 3
    مؤتمر
    Process Recipes for Additively Printed Copper-Ink Flexible Circuits using Direct Write Methods

    المؤلفون: Lall, Pradeep, Narangaparambil, Jinesh, Schulze, Kyle, Hill, Curtis

    المصدر: 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2021 20th IEEE Intersociety Conference on. :1061-1072 Jun, 2021

    Relation: 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)

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  4. 4
    مؤتمر
    Printed flexible LC filter using the micro-dispensing technique using silver conductive pasted and ECA for component attachment

    المؤلفون: Lall, Pradeep, Narangaparambil, Jinesh, Schulze, Kyle, Miller, Scott

    المصدر: 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2021 20th IEEE Intersociety Conference on. :787-796 Jun, 2021

    Relation: 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)

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  5. 5
    مؤتمر
    Electrically Conductive Adhesive Interconnections on Additively Printed Substrates

    المؤلفون: Lall, Pradeep, Goyal, Kartik, Schulze, Kyle, Miller, Scott

    المصدر: 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2021 20th IEEE Intersociety Conference on. :807-817 Jun, 2021

    Relation: 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)

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  6. 6
    مؤتمر
    Low Temperature Solder Interconnection of Surface Mount Devices with Additively Printed Pads on Flexible Substrate

    المؤلفون: Lall, Pradeep, Goyal, Kartik, Schulze, Kyle, Miller, Scott

    المصدر: 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2021 20th IEEE Intersociety Conference on. :972-980 Jun, 2021

    Relation: 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)

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  7. 7
    مؤتمر
    Interconnection of Passive Components using Printed Aerosol-Jet Traces

    المؤلفون: Lall, Pradeep, Narangaparambil, Jinesh, Schulze, Kyle, Miller, Scott

    المصدر: 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2021 20th IEEE Intersociety Conference on. :1052-1060 Jun, 2021

    Relation: 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)

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  8. 8
    مؤتمر
    Process-Consistency in Printed Layers in Multi-Layer Substrate Using Aerosol Jet Technology

    المؤلفون: Lall, Pradeep, Goyal, Kartik, Schulze, Kyle, Miller, Scott

    المصدر: 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2020 19th IEEE Intersociety Conference on. :814-820 Jul, 2020

    Relation: 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

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  9. 9
    مؤتمر
    Process Development for Printing Z-Axis Interconnects in Multilayered Flexible Substrates

    المؤلفون: Lall, Pradeep, Soni, Ved, Narangaparambil, Jinesh, Schulze, Kyle, Miller, Scott

    المصدر: 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2020 19th IEEE Intersociety Conference on. :844-853 Jul, 2020

    Relation: 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

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  10. 10
    دورية أكاديمية
    Intragranular irradiation-assisted stress corrosion cracking (IASCC) of 316L stainless steel made by laser direct energy deposition additive manufacturing: Delta ferrite-dislocation channel interaction

    المؤلفون: Yang, Jingfan, Hawkins, Laura, He, Lingfeng, Mahmood, Samsul, Song, Miao, Schulze, Kyle, Lou, Xiaoyuan

    المصدر: In Journal of Nuclear Materials 15 April 2023 577

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