المؤلفون: Caers, J. F. J. M., Zhao, X. J., Wong, E. H., Seah, S. K. W., Selvanayagam, C. S., van Driel, W. D., Owens, N., Leoni, M., Tan, L. C., Eu, P. L., Lai, Y.-S., Yeh, C.-L.

المصدر: IEEE Transactions on Electronics Packaging Manufacturing IEEE Trans. Electron. Packag. Manufact. Electronics Packaging Manufacturing, IEEE Transactions on. 33(2):84-90 Apr, 2010

المؤلفون: Selvanayagam, C. S., Lau, J. H., Zhang, X., Seah, S. K. W., Vaidyanathan, K., Chai, T. C.

المصدر: IEEE Transactions on Advanced Packaging IEEE Trans. Adv. Packag. Advanced Packaging, IEEE Transactions on. 32(4):720-728 Nov, 2009

المؤلفون: Rajoo, R., Lim, S. S., Wong, E. H., Hnin, W. Y., Seah, S. K. W., Tay, A. A. O., Iyer, M., Tummala, R. R.

المصدر: IEEE Transactions on Advanced Packaging IEEE Trans. Adv. Packag. Advanced Packaging, IEEE Transactions on. 31(2):377-385 May, 2008

المؤلفون: Wong, E. H., Mai, Y.-W., Seah, S. K. W., Lim, K. M., Lim, T. B.

المصدر: IEEE Transactions on Advanced Packaging IEEE Trans. Adv. Packag. Advanced Packaging, IEEE Transactions on. 30(4):654-664 Nov, 2007

المؤلفون: Lai, Yi-Shao, Wong, E. H., Rajoo, R., Seah, S. K. W., Selvanayagam, C. S., van Driel, W. D., Caers, J. F. J. M., Zhao, X. J., Owens, N., Tan, L. C., Leoni, M., Eu, P. L.

المصدر: 2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference Microsystems, Packaging, Assembly & Circuits Technology Conference, 2008. IMPACT 2008. 3rd International. :57-62 Oct, 2008

Relation: 2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference (IMPACT)

المؤلفون: Selvanayagam, Cheryl S., Lau, John H., Xiaowu Zhang, Seah, S. K. W., Vaidyanathan, Kripesh, Chai, T. C.

المصدر: 2008 58th Electronic Components and Technology Conference Electronic Components and Technology Conference, 2008. ECTC 2008. 58th. :1073-1081 May, 2008

Relation: 2008 58th Electronic Components and Technology Conference (ECTC 2008)

المؤلفون: Wong, E. H., Seah, S. K. W., van Driel, W. D., Caers, J. F. J. M., Owens, N., Lai, Y. -S.

المصدر: EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, 2008. EuroSimE 2008. International Conference on. :1-9 Apr, 2008

Relation: 2008 Intl. Conf. on Thermal, Mechanical & Multi-Physics simulation and Experiments in Microelectronics

لا يتم عرض هذه النتيجة على الضيوف.
تسجيل الدخول للوصول الكامل.

المؤلفون: Wong, E. H., Seah, S. K. W., Shim, V. P. W.

المصدر: Journal of Electronic Materials. February 2014 43(2):586-593

لا يتم عرض هذه النتيجة على الضيوف.
تسجيل الدخول للوصول الكامل.