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1مؤتمر
المؤلفون: Negishi, Ryo, Saito, Satoshi, Tomatsu, Itsuro
المصدر: 2024 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2024 International Conference on. :83-84 Apr, 2024
Relation: 2024 International Conference on Electronics Packaging (ICEP)
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2مؤتمر
المؤلفون: Yonezawa, R., Yu, K., Aizawa, H., Suzuki, H., Wajda, C., Leusink, G.
المصدر: 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM) Advanced Metallization Conference (MAM)(IITC/MAM), 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for. :1-3 May, 2023
Relation: 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM)
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3مؤتمر
المؤلفون: Pedreira, O. Varela, Simons, V., van der Veen, M.H, Ciofi, I., Park, S., Tokei, Zs., Croes, K., Pethe, S., Lei, W., Hwang, S., Wu, Z., Chen, F., Jansen, A., Machillot, J., Cockburn, A.
المصدر: 2022 IEEE International Interconnect Technology Conference (IITC) Interconnect Technology Conference (IITC), 2022 IEEE International. :31-33 Jun, 2022
Relation: 2022 IEEE International Interconnect Technology Conference (IITC)
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4مؤتمر
المؤلفون: Negishi, Ryo, Saito, Satoshi, Tomatsu, Itsuro
المصدر: 2023 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2023 International Conference on. :9-10 Apr, 2023
Relation: 2023 International Conference on Electronics Packaging (ICEP)
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5مؤتمر
المؤلفون: Bagochus, Evgeniy K., Kichay, Vadim N., Prinz, Victor Ya.
المصدر: 2021 IEEE 22nd International Conference of Young Professionals in Electron Devices and Materials (EDM) Young Professionals in Electron Devices and Materials (EDM), 2021 IEEE 22nd International Conference of. :75-78 Jun, 2021
Relation: 2021 IEEE 22nd International Conference of Young Professionals in Electron Devices and Materials (EDM)
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6دورية أكاديمية
المؤلفون: Inoue, F., Iacovo, S., El-Mekki, Z., Kim, S., Struyf, H., Beyne, E.
المصدر: IEEE Electron Device Letters IEEE Electron Device Lett. Electron Device Letters, IEEE. 42(12):1826-1829 Dec, 2021
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7دورية أكاديمية
المؤلفون: Demaude, A.Aff1, IDs11090023103556_cor1, Petitjean, D., Brabant, M., Gordon, M. J., Reniers, F.
المصدر: Plasma Chemistry and Plasma Processing. 43(6):1731-1748
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8دورية أكاديمية
المؤلفون: Ngoc Van, Tran Thi, Kim, Changsu, Lee, Hojae, Kim, JiyongAff2, IDs0089402305806y_cor4, Shong, BonggeunAff1, IDs0089402305806y_cor5
المصدر: Journal of Molecular Modeling: Computational Chemistry - Life Science - Advanced Materials - New Methods. 30(1)
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9دورية أكاديمية
المؤلفون: Kim, Jun Hyun, Lee, Ja Yeon, Kim, Eung Soo, Jeong, Myung YungAff4, IDs43074023000864_cor4
المصدر: PhotoniX. 4(1)
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10دورية أكاديمية
المؤلفون: Jayant Kumar Lodha, Johan Meersschaut, Mattia Pasquali, Hans Billington, Stefan De Gendt, Silvia Armini
المصدر: Nanomaterials, Vol 14, Iss 14, p 1212 (2024)
مصطلحات موضوعية: self-assembled monolayer, defect analysis, Ruthenium ALD, area selective deposition, Chemistry, QD1-999
وصف الملف: electronic resource