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1مؤتمر
المؤلفون: Lee, Joseph Y., JungWon Lee, Yul-Kyu Chung, SeogMoon Choi, Jongin Ryu, BumSik Jang
المصدر: 2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) Electronic Manufacturing Technology Symposium (IEMT), 2008 33rd IEEE/CPMT International. :1-4 Nov, 2008
Relation: 2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT)
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2مؤتمرReliability evaluation and structure design optimization of Wafer Level Chip Scale Packaging (WLCSP)
المؤلفون: Shan Gao, Jupyo Hong, Jinsu Kim, Jingu Kim, Seogmoon Choi, Sung Yi
المصدر: 2008 2nd Electronics System-Integration Technology Conference Electronics System-Integration Technology Conference, 2008. ESTC 2008. 2nd. :701-706 Sep, 2008
Relation: 2008 2nd Electronics System-Integration Technology Conference (ESTC)
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3مؤتمر
المؤلفون: Shan Gao, Jupyo Hong, Sanghyun Shin, Yongki Lee, Seogmoon Choi, Sung Yi
المصدر: 2008 58th Electronic Components and Technology Conference Electronic Components and Technology Conference, 2008. ECTC 2008. 58th. :798-803 May, 2008
Relation: 2008 58th Electronic Components and Technology Conference (ECTC 2008)
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4مؤتمر
المؤلفون: Shan Gao, Jupyo Hong, Jungho Hyun, Seogmoon Choi, Sung Yi
المصدر: 2007 International Conference on Electronic Materials and Packaging Electronic Materials and Packaging, 2007. EMAP 2007. International Conference on. :1-4 Nov, 2007
Relation: 2007 International Conference on Electronic Materials and Packaging (EMAP 2007)
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5
المؤلفون: Kyung-Wook Paik, Yong-Min Kwon, Taesung Jeong, Jin Su Kim, Seogmoon Choi, Seon Young Yu
المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology. 2:625-633
مصطلحات موضوعية: Engineering, Interconnection, business.product_category, business.industry, Mechanical engineering, Temperature cycling, Industrial and Manufacturing Engineering, Finite element method, Electronic, Optical and Magnetic Materials, System in package, Reliability (semiconductor), Soldering, Ball grid array, Electronic engineering, Die (manufacturing), Electrical and Electronic Engineering, business
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::fe3b22a33e30656b05b57ab7c172feae
https://doi.org/10.1109/tcpmt.2011.2166555
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6
المؤلفون: Soon Cheol Kweon, Young Ki Lee, Su-Ho Shin, Kyu-ho Shin, Ki-hwan Kwon, Seogmoon Choi
المصدر: Journal of Microelectronics and Electronic Packaging. 3:67-72
مصطلحات موضوعية: Materials science, Computer Networks and Communications, business.industry, Anodizing, Thermal resistance, Electrical engineering, Chip, Electronic, Optical and Magnetic Materials, law.invention, Printed circuit board, law, Optoelectronics, Transient (oscillation), Electrical and Electronic Engineering, business, Layer (electronics), Light-emitting diode, Diode
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::64020eaff8a918738a9bfae530b40895
https://doi.org/10.4071/1551-4897-3.2.67 -
7
المؤلفون: Kyung-Wook Paik, Seon Young Yu, Seogmoon Choi, Tae-sung Jeong, Yong-Min Kwon, Jin Su Kim
المصدر: 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).
مصطلحات موضوعية: Engineering, Interconnection, business.product_category, business.industry, ComputerSystemsOrganization_COMPUTER-COMMUNICATIONNETWORKS, Mechanical engineering, Temperature cycling, Drop test, System in package, Embedded system, visual_art, Ball grid array, Electronic component, visual_art.visual_art_medium, Drop (telecommunication), Die (manufacturing), business
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::b09c1d1e5d5cfadf9208caf3b54f8d80
https://doi.org/10.1109/ectc.2011.5898551 -
8
المؤلفون: Gabor Farkas, Zoltan Sarkany, Jongman Kim, Shan Gao, Andras Vass-Varnai, Marta Rencz, Seogmoon Choi, Andras Poppe
مصطلحات موضوعية: Materials science, 020209 energy, Thermal resistance, 020208 electrical & electronic engineering, Mechanical engineering, 02 engineering and technology, Insulated-gate bipolar transistor, Temperature cycling, Chip, Characterization (materials science), Thermal, 0202 electrical engineering, electronic engineering, information engineering, Electronic engineering, Point (geometry), Transient (oscillation)
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::38f1feef8479008710e9cdee4000f1c7
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9
المؤلفون: BumSik Jang, Yul-Kyu Chung, Jungwon Lee, Joseph Y Lee, Jongin Ryu, Seogmoon Choi
المصدر: 2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT).
مصطلحات موضوعية: Permittivity, Materials science, business.industry, Electronic engineering, Optoelectronics, Dissipation factor, Wafer, Dielectric loss, Dielectric, Thin film, business, Power density, Pulsed laser deposition
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::fe379c016c5782446533e16859688f93
https://doi.org/10.1109/iemt.2008.5507849 -
10Reliability evaluation and structure design optimization of Wafer Level Chip Scale Packaging (WLCSP)
المؤلفون: Jupyo Hong, Shan Gao, Jin Su Kim, Jin-Gu Kim, Seogmoon Choi, Sung Yi
المصدر: 2008 2nd Electronics Systemintegration Technology Conference.
مصطلحات موضوعية: Stress (mechanics), Materials science, Reliability (semiconductor), Chip-scale package, business.industry, Soldering, Structural engineering, business, Wafer-level packaging, Die (integrated circuit), Finite element method, Stress concentration
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::077552a53ae899cdce425b4f49174cf2
https://doi.org/10.1109/estc.2008.4684436
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