المؤلفون: jun mi jeon, Sang‑Jun Kwon, Seok Bon Koo, Chang‑Myeon Lee, Jin Young Hur, Hong-Kee Lee

المصدر: Metals and Materials International. 25:117-126

مصطلحات موضوعية: Copper oxide, Materials science, 020502 materials, Metals and Alloys, chemistry.chemical_element, 02 engineering and technology, Adhesion, Condensed Matter Physics, Copper, chemistry.chemical_compound, 0205 materials engineering, chemistry, Mechanics of Materials, Impurity, Plating, Materials Chemistry, Grain boundary, Composite material, Layer (electronics), Polyimide

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::8ed64c2dc6e288c124b48e1e1405bea7
https://doi.org/10.1007/s12540-018-0167-7

المؤلفون: Hong-Kee Lee, Seong-Ho Son, Ho-Young Lee, Seok-Bon Koo

المصدر: Journal of Adhesion Science & Technology; 2008, Vol. 22 Issue 1, p47-64, 18p, 1 Diagram, 5 Charts, 8 Graphs

مصطلحات موضوعية: ADHESION, ELECTROPLATING, POLYIMIDES, ETHYLENEDIAMINE, ATOMIC force microscopy