يعرض 1 - 10 نتائج من 305,048 نتيجة بحث عن '"Seong, IS"', وقت الاستعلام: 1.44s تنقيح النتائج
  1. 1
    مؤتمر
    Single and Multi NPU Chiplet Heterogeneous Integration packaging based on Fanout RDL interposer with Silicon bridge technology

    المؤلفون: Kang, Lewis, Kim, Jay, Lee, Bruce, Park, Jade, Yu, Han Ju, Lee, Sung Hyuk, Lim, Jacinta Aman, Lee, Min Ji, Han, Seong Hwan, Lee, Jae Kyung, Hwang, Hailey

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1603-1608 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  2. 2
    مؤتمر
    Reliability of Indium Solder Joints using a Laser-Assisted Bonding (LAB) Process at Room Temperature

    المؤلفون: Jung, Ji Eun, Eom, Yong-Sung, Joo, Jiho, Choi, Gwang-Mun, Shin, Jung-Ho, Lee, Chanmi, Jang, Ki-Seok, Oh, Jin-Hyuk, Lee, Ga Eun, Choi, Kwang-Seong, Lee, Seung-Yoon

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :2237-2243 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  3. 3
    مؤتمر
    Chip-on-Wafer (CoW) Technology Utilizing Laser-Assisted Bonding with Compression (LABC) for Bump Counts Exceeding 500,000 at a 20 μm Pitch

    المؤلفون: Choi, Kwang-Seong, Joo, Jiho, Choi, Gwang-Mun, Shin, Jungho, Lee, Chanmi, Jang, Ki-Seok, Oh, Jin-Hyuk, Yun, Ho-Gyeong, Moon, Seok Hwan, Jung, Ji Eun, Lee, Gaeun, Eom, Yong-Sung

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :943-948 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  4. 4
    مؤتمر
    Advanced Bonding Process based on Intense Pulsed Light Irradiation for Solder Bump in Flip-Chip Package

    المؤلفون: Ryu, Seong-Ung, Park, Jong-Whi, Ju, Young-Min, Kim, Hak-Sung

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :2218-2222 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  5. 5
    مؤتمر
    A preliminary study of neural signals of Motor Imagery task of Arm movements through Electroencephalography data Classification with Machine Learning

    المؤلفون: Firoz, Kazi Farzana, Seong, Younho, Yi, Sun

    المصدر: 2024 IEEE 4th International Conference on Human-Machine Systems (ICHMS) Human-Machine Systems (ICHMS), 2024 IEEE 4th International Conference on. :1-6 May, 2024

    Relation: 2024 IEEE 4th International Conference on Human-Machine Systems (ICHMS)

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  6. 6
    مؤتمر
    Gate Resistance Test Structures Bounded by Local Layout Density to Characterize Metal Gate Height Variation in 7nm FinFET Technology

    المؤلفون: Zhu, Hai, Onishi, Katsunori, Tzou, Thomas, Fayaz, Mohammed Fazil, Jeong, Byoung-Wook, Lim, Seong-Joon, Chidambarrao, Dureseti

    المصدر: 2024 IEEE 33rd Microelectronics Design & Test Symposium (MDTS) Microelectronics Design & Test Symposium (MDTS), 2024 IEEE 33rd. :1-4 May, 2024

    Relation: 2024 IEEE 33rd Microelectronics Design & Test Symposium (MDTS)

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  7. 7
    مؤتمر
    Robustness to Device Degradation in Silicon FeFET-based Reservoir Computing (Invited)

    المؤلفون: Toprasertpong, Kasidit, Nako, Eishin, Min, Shin-Yi, Cai, Zuocheng, Cho, Seong-Kun, Suzuki, Rikuo, Nakane, Ryosho, Takenaka, Mitsuru, Takagi, Shinichi

    المصدر: 2024 IEEE International Reliability Physics Symposium (IRPS) International Reliability Physics Symposium (IRPS), 2024 IEEE. :1-6 Apr, 2024

    Relation: 2024 IEEE International Reliability Physics Symposium (IRPS)

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  8. 8
    مؤتمر
    Comparison of Combination of MOV and RCD Snubber to Reduce Surge Voltage of DC Solid-State Circuit Breaker

    المؤلفون: Lim, Seong Jin, Song, Sung-Geun, Choi, Jung-Sik, Kang, Feel-soon

    المصدر: 2024 10th International Conference on Applied System Innovation (ICASI) Applied System Innovation (ICASI), 2024 10th International Conference on. :294-296 Apr, 2024

    Relation: 2024 10th International Conference on Applied System Innovation (ICASI)

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  9. 9
    مؤتمر
    Effective Surge Voltage Reduction Using Parallel-Connected SiC Switches and Inverse-Current Injection Method in DC Solid-State Circuit Breaker

    المؤلفون: Jo, Jae-Seong, Lee, Sang-Hyeok, Song, Sung-Geun, Kang, Feel-soon

    المصدر: 2024 10th International Conference on Applied System Innovation (ICASI) Applied System Innovation (ICASI), 2024 10th International Conference on. :291-293 Apr, 2024

    Relation: 2024 10th International Conference on Applied System Innovation (ICASI)

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  10. 10
    دورية أكاديمية
    Machine Learning Explainability for Intrusion Detection in the Industrial Internet of Things

    المؤلفون: Ahakonye, Love Allen Chijioke, Nwakanma, Cosmas Ifeanyi, Lee, Jae Min, Kim, Dong-Seong

    المصدر: IEEE Internet of Things Magazine IEEE Internet Things M. Internet of Things Magazine, IEEE. 7(3):68-74 May, 2024

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