يعرض 1 - 10 نتائج من 15 نتيجة بحث عن '"Sepaintner, Felix"', وقت الاستعلام: 1.00s تنقيح النتائج
  1. 1
    مؤتمر
    A Modified Gradient Model to Determine Surface Impedance from Measured Roughness Profiles with Printed Circuit Board Emphasis

    المؤلفون: Sepaintner, Felix, Scharl, Andreas, Jakob, Johannes, Roehrl, Franz, Bogner, Werner, Zorn, Stefan

    المصدر: 2024 IEEE/MTT-S International Microwave Symposium - IMS 2024 Microwave Symposium - IMS 2024, 2024 IEEE/MTT-S International. :563-566 Jun, 2024

    Relation: 2024 IEEE/MTT-S International Microwave Symposium - IMS 2024

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  2. 2
    مؤتمر
    A Robust And Cost-Effective Process Control Monitor Concept to Verify Quality Characteristics of Printed Circuit Boards up to 40 GHz

    المؤلفون: Sepaintner, Felix, Scharl, Andreas, Jakob, Johannes, Rohrl, Franz, Bogner, Werner, Zorn, Stefan

    المصدر: 2024 15th German Microwave Conference (GeMiC) German Microwave Conference (GeMiC), 2024 15th. :253-256 Mar, 2024

    Relation: 2024 15th German Microwave Conference (GeMiC)

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  3. 3
    مؤتمر
    Reliability Investigations of Additive Manufactured RF-Structures on Low-Cost PCB Materials Based on Inkjet Technology

    المؤلفون: Schmalzbauer, Michael, Jakob, Johannes, Rohrl, Franz X., Sepaintner, Felix, Scharl, Andreas, Lobbicke, Kai, Bogner, Werner, Zorn, Stefan

    المصدر: 2021 51st European Microwave Conference (EuMC) European Microwave Conference (EuMC), 2021 51st. :330-333 Apr, 2022

    Relation: 2021 51st European Microwave Conference (EuMC)

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  4. 4
    مؤتمر
    A Cost-Effective Method for Extracting the Complex Permittivity of Inner Layer Dielectric PCB Materials

    المؤلفون: Scharl, Andreas, Sepaintner, Felix, Jakob, Johannes, Rohrl, Franz Xaver, Bogner, Werner, Zorn, Stefan

    المصدر: 2021 51st European Microwave Conference (EuMC) European Microwave Conference (EuMC), 2021 51st. :470-473 Apr, 2022

    Relation: 2021 51st European Microwave Conference (EuMC)

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  5. 5
    مؤتمر
    Comparison of an Inkjet Fabrication Method on Low-Cost PCB Substrates With Semi Additive And Subtractive Technologies Regarding RF-Performance

    المؤلفون: Sepaintner, Felix, Schmalzbauer, Michael, Jakob, Johannes, Scharl, Andreas, Weber, Georg, Roehrl, Franz Xaver, Bogner, Werner, Zorn, Stefan

    المصدر: 2021 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP) Advanced Materials and Processes for RF and THz Applications (IMWS-AMP), 2021 IEEE MTT-S International Microwave Workshop Series on. :266-268 Nov, 2021

    Relation: 2021 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP)

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  6. 6
    مؤتمر
    Design and Comparison of Filter Structures in the Millimeter Wave Frequency Range on Outer- and Inner-Layers of Organic Circuit Boards

    المؤلفون: Scharl, Andreas, Sepaintner, Felix, Jakob, Johannes, Scholz, David, Xaver Rohrl, Franz, Bogner, Werner, Zorn, Stefan

    المصدر: 2020 50th European Microwave Conference (EuMC) Microwave Conference (EuMC), 2020 50th European. :970-973 Jan, 2021

    Relation: 2020 50th European Microwave Conference (EuMC)

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  7. 7
    مؤتمر
    Simulation and Measurement of PCB Crossover Structures from DC up to 70 GHz

    المؤلفون: Scharl, Andreas, Sepaintner, Felix, Rohrl, Franz Xaver, Bogner, Werner, Zorn, Stefan

    المصدر: 2020 German Microwave Conference (GeMiC) German Microwave Conference (GeMiC), 2020. :228-231 Mar, 2020

    Relation: 2020 German Microwave Conference (GeMiC)

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  8. 8
    مؤتمر
    Cost-Effective Implementation of Air-Filled Waveguides on Printed Circuit Boards

    المؤلفون: Sepaintner, Felix, Scharl, Andreas, Jakob, Johannes, Keck, Florian, Kunze, Kevin, Rohrl, Franz Xaver, Bogner, Werner, Zorn, Stefan

    المصدر: 2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) Electrical Performance of Electronic Packaging and Systems (EPEPS), 2020 IEEE 29th Conference on. :1-3 Oct, 2020

    Relation: 2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)

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  9. 9
    مؤتمر
    Extracting Complex PCB Substrate Permittivity from a Transmission Line using the Finite Difference Integral Method from 10 GHz - 100 GHz

    المؤلفون: Sepaintner, Felix, Scharl, Andreas, Rohrl, Franz Xaver, Bogner, Werner, Zorn, Stefan

    المصدر: 2020 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP) Advanced Materials and Processes for RF and THz Applications (IMWS-AMP), 2020 IEEE MTT-S International Microwave Workshop Series on. :1-3 Jul, 2020

    Relation: 2020 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP)

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  10. 10
    مؤتمر
    Simulation and Manufacturing of Low Loss PCB Structures with Additional Electromagnetic Field in Air

    المؤلفون: Sepaintner, Felix, Scharl, Andreas, Rohrl, Franz Xaver, Bogner, Werner, Zorn, Stefan Zorn

    المصدر: 2019 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP) Advanced Materials and Processes for RF and THz Applications (IMWS-AMP), 2019 IEEE MTT-S International Microwave Workshop Series on. :94-96 Jul, 2019

    Relation: 2019 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP)

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