المؤلفون: Dittrich, Th., Parisini, A., Pavesi, M., Baraldi, A., Sacchi, A., Mezzadri, F., Mazzolini, P., Bosi, M., Seravalli, L., Bosio, A., Fornari, R.

المصدر: In Surfaces and Interfaces August 2024 51

المؤلفون: Mazzolini, P., Varley, J.B., Parisini, A., Sacchi, A., Pavesi, M., Bosio, A., Bosi, M., Seravalli, L., Janzen, B.M., Marggraf, M.N., Bernhardt, N., Wagner, M.R., Ardenghi, A., Bierwagen, O., Falkenstein, A., Kler, J., De Souza, R.A., Martin, M., Mezzadri, F., Borelli, C., Fornari, R.

المصدر: In Materials Today Physics June 2024 45

المؤلفون: Esposito, F., Bosi, M., Attolini, G., Rossi, F., Panasci, S.E., Fiorenza, P., Giannazzo, F., Fabbri, F., Seravalli, L.

المصدر: In Applied Surface Science 1 December 2023 639

المؤلفون: Zolnai, Z., Petrik, P., Németh, A., Volk, J., Bosi, M., Seravalli, L., Fornari, R.

المصدر: In Applied Surface Science 1 November 2023 636

المؤلفون: Seravalli, L.

المصدر: In Microelectronic Engineering 1 May 2023 276

المؤلفون: Carrete, J., Vermeersch, B., Thumfart, L., Kakodkar, R. R., Trevisi, G., Frigeri, P., Seravalli, L., Feser, J. P., Rastelli, A., Mingo, N.

مصطلحات موضوعية: Condensed Matter - Materials Science

URL الوصول: http://arxiv.org/abs/1710.03449

المؤلفون: Colace, L., Bronzoni, M., De Iacovo, A., Frigeri, P., Gombia, E., Maragliano, C., Mezzadri, F., Nasi, L., Pattini, F., Rampino, S., Seravalli, L., Trevisi, G.

المصدر: 2014 Fotonica AEIT Italian Conference on Photonics Technologies Photonics Technologies, 2014 Fotonica AEIT Italian Conference on. :1-4 May, 2014

Relation: 2014 Fotonica AEIT Italian Conference on Photonics Technologies (Fotonica AEIT)

المؤلفون: Capineri, Lorenzo^Aff3, Pochanin, Gennadiy^Aff4, Bechtel, Timothy^Aff5, Capan, Ivana^Aff6, Brodar, Tomislav^Aff6, Pastuović, Željko^Aff7, Coutinho, Jose^Aff8, Radulović, Vladimir^Aff9, Snoj, Luka^Aff9, Ohshima, Takeshi^Aff10, Palucci, Antonio^Aff11, Colao, Francesco^Aff11, Milovan, Stoiljkovic^Aff12, Kolobrodov, Valentin^Aff13, Boonaker, Bart^Aff14, Schnürer, Frank^Aff15, Stifini, Cristiano^Aff16, Carnevale, Luigi^Aff17, Cassioli, Lieutenant Colonel Luigi^Aff18, De Muro, Stefano^Aff19, Antuofermo, Pasquale^Aff20, Attolini, G.^Aff21, Beretta, S.^Aff21, Bosi, M.^Aff21, Ferrari, C.^Aff21, Frigeri, C.^Aff21, Frigeri, P.^Aff21, Gombia, E.^Aff21, Lazzarini, L.^Aff21, Rossi, F.^Aff21, Seravalli, L.^Aff21, Trevisi, G.^Aff21, Hasanov, Rovshan^Aff22, Sultanov, Chingiz^Aff22, Gahramanova, Gulnaz^Aff22, Musayeva, Nahida^Aff22, Orujov, Teymur^Aff22, Sansone, Francesco^Aff23, Baldini, Laura^Aff23, Rispoli, Francesco^Aff23, Momtaz, Zahra Sadre^Aff24, Pingue, Pasqualantonio^Aff24, Roddaro, Stefano^Aff24, Unlu, Mehmet Burcin^Aff25, Pavlov, Ihor^Aff26, Serozhkin, Yuriy^Aff27, Gleich, Dušan^Aff28, Kafedziski, Venceslav^Aff29, Skejić, Emir^Aff30, Steker, Ivan^Aff31, Babic, Zdenka^Aff32, Turnbull, Graham^Aff33, Mustra, Mario^Aff34, Rameev, Bulat^{Aff35, Aff36}, Mozzhukhin, Georgy^Aff35, Tarapov, Sergey^{Aff37, Aff38, Aff39}, Ünal, İlhami^Aff40, Tábi, Levente^Aff41, Torroba, Tomás^Aff42, Schechter, Israel^Aff43, García-Calvo, José^Aff42, Revilla-Cuesta, Andrea^Aff42, Lazoul, Mohamed^Aff44, Maamar, Noureddine^Aff44, Amel, Bellada^Aff44, Laurell, Fredrik^Aff45, Coutaz, Jean-Louis^Aff46, Piletsky, Sergey^Aff47, Chegel, Volodymyr^Aff48, Lopatynskyi, Andrii^Aff48, Lytvyn, Vitalii^Aff48, Pastor, Juan Martinez^Aff49, Abargues, Rafael^Aff49, Rodríguez, Pedro^Aff50, Lukin, K.^Aff51, Tatyanko, D.^Aff51, Palamarchuck, V.^Aff51, Vyplavin, P.^Aff51, Lukin, S.^Aff51, Zemlyanіy, O.^Aff51, Shiyan, Yu.^Aff51, Mishchenko, O.^Aff51, Yurchenko, L.^Aff51, Sushchenko, P.^Aff51, Sato, Motoyuki^Aff52, Charrue, Pierre^Aff53

المساهمون: Capineri, Lorenzo, editor^Aff1, Turmuş, Eyüp Kuntay, editor^Aff2

المصدر: Explosives Detection : Sensors, Electronic Systems and Data Processing. :33-324

المؤلفون: Golovynskyi, S., Datsenko, O.I., Seravalli, L., Trevisi, G., Frigeri, P., Gombia, E., Li, Baikui, Qu, Junle

المصدر: In Microelectronic Engineering 1 June 2020 230

المؤلفون: Beretta, S., Bosi, M., Seravalli, L., Musayeva, N., Ferrari, C.

المصدر: In Materials Today: Proceedings 2020 20 Part 1:30-36