المؤلفون: Stippich, Alexander, Kamp, Tobias, Sewergin, Alexander, Fraeger, Lukas, Wienhausen, Arne Hendrik, Bundgen, David, De Doncker, Rik W.

المصدر: 2019 IEEE Energy Conversion Congress and Exposition (ECCE) Energy Conversion Congress and Exposition (ECCE), 2019 IEEE. :5329-5336 Sep, 2019

Relation: 2019 IEEE Energy Conversion Congress and Exposition (ECCE)

المؤلفون: Wienhausen, Arne Hendrik, Sewergin, Alexander, De Doncker, Rik W.

المصدر: 2019 IEEE Applied Power Electronics Conference and Exposition (APEC) Applied Power Electronics Conference and Exposition (APEC), 2019 IEEE. :1281-1288 Mar, 2019

Relation: 2019 IEEE Applied Power Electronics Conference and Exposition (APEC)

المؤلفون: Sewergin, Alexander, Stippich, Alexander, De Doncker, Arne Hendrik Wienhausen Rik W.

المصدر: 2019 IEEE Applied Power Electronics Conference and Exposition (APEC) Applied Power Electronics Conference and Exposition (APEC), 2019 IEEE. :2822-2825 Mar, 2019

Relation: 2019 IEEE Applied Power Electronics Conference and Exposition (APEC)

المؤلفون: Engelmann, Georges, Sewergin, Alexander, Neubert, Markus, De Doncker, Rik W.

المصدر: 2018 International Power Electronics Conference (IPEC-Niigata 2018 -ECCE Asia) Power Electronics Conference (IPEC-Niigata 2018 –ECCE Asia), 2018 International. :3979-3984 May, 2018

Relation: 2018 International Power Electronics Conference (IPEC-Niigata 2018 –ECCE Asia)

المؤلفون: Wienhausen, Arne Hendrik, Sewergin, Alexander, Engel, Stefan P., De Doncker, Rik W.

المصدر: 2017 IEEE 12th International Conference on Power Electronics and Drive Systems (PEDS) Power Electronics and Drive Systems (PEDS), 2017 IEEE 12th International Conference on. :442-447 Dec, 2017

Relation: 2017 IEEE 12th International Conference on Power Electronics and Drive Systems (PEDS)

المؤلفون: Sewergin, Alexander, Wienhausen, Arne Hendrik, Oberdieck, Karl, De Doncker, Rik W.

المصدر: 2017 IEEE 12th International Conference on Power Electronics and Drive Systems (PEDS) Power Electronics and Drive Systems (PEDS), 2017 IEEE 12th International Conference on. :277-281 Dec, 2017

Relation: 2017 IEEE 12th International Conference on Power Electronics and Drive Systems (PEDS)

المؤلفون: Oberdieck, Karl, Sewergin, Alexander, De Doncker, Rik W.

المصدر: 2017 International Symposium on Electromagnetic Compatibility - EMC EUROPE Electromagnetic Compatibility - EMC EUROPE, 2017 International Symposium on. :1-6 Sep, 2017

Relation: 2017 International Symposium on Electromagnetic Compatibility - EMC EUROPE

المؤلفون: Stippich, Alexander, Neubert, Markus, Sewergin, Alexander, De Doncker, Rik W.

المصدر: 2016 IEEE 2nd Annual Southern Power Electronics Conference (SPEC) Power Electronics Conference (SPEC), IEEE Annual Southern. :1-6 Dec, 2016

Relation: 2016 IEEE 2nd Annual Southern Power Electronics Conference (SPEC)

المؤلفون: Sewergin, Alexander

مصطلحات موضوعية: silicon carbide , wide-bandgap semiconductor , low-inductive switching-cell , 3d-printed cooling structure , intelligent power module , Siliziumkarbid , Halbleiter mit breiter Bandlücke , niederinduktive Schaltzelle , 3d-gedruckte Kühlstruktur , intelligentes Leistungsmodul

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::e59604406887526f231556d32b0f4c03

المؤلفون: Sewergin, Alexander

المساهمون: de Doncker, Rik W., März, Martin

المصدر: Aachen : ISEA, Aachener Beiträge des ISEA 154, 1 Online-Ressource : Illustrationen, Diagramme (2021). doi:10.18154/RWTH-2021-04498 = Dissertation, Rheinisch-Westfälische Technische Hochschule Aachen, 2021

مصطلحات موضوعية: niederinduktive Schaltzelle, wide-bandgap semiconductor, ddc:621.3, silicon carbide, low-inductive switching-cell, Siliziumkarbid, intelligent power module, 3d-gedruckte Kühlstruktur, Halbleiter mit breiter Bandlücke, 3d-printed cooling structure, intelligentes Leistungsmodul

URL الوصول: https://explore.openaire.eu/search/publication?articleId=od_______791::4391d1d6340ba20a780b8bb0a9575f55