-
1مؤتمر
المؤلفون: Pan, Yuxin, Fei, Xihong, Shan, Bo, Shen, Hao, Wang, Jing, Wang, Kang
المصدر: 2024 36th Chinese Control and Decision Conference (CCDC) Control and Decision Conference (CCDC), 2024 36th Chinese. :6109-6114 May, 2024
Relation: 2024 36th Chinese Control and Decision Conference (CCDC)
-
2مؤتمر
المؤلفون: Tsai, Min-Yan, Kao, Chin-Li, Wang, Shan-Bo, Lin, Yung-Sheng, Chiu, Meng-Chun, Liang, Chien-Lung
المصدر: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2023 IEEE 25th. :326-332 Dec, 2023
Relation: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
-
3مؤتمر
المؤلفون: Liang, Chien-Lung, Lin, Yung-Sheng, Tsai, Min-Yan, Chiu, Meng-Chun, Wang, Shan-Bo, Hung, Chih-Pin, Lin, Kwang-Lung
المصدر: 2024 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2024 International Conference on. :1-2 Apr, 2024
Relation: 2024 International Conference on Electronics Packaging (ICEP)
-
4مؤتمر
المؤلفون: Shan, Bo, Wang, Xiaoyan, Zhang, Xuekai, Huang, Peng, Li, Qian
المصدر: 2023 4th International Conference for Emerging Technology (INCET) Emerging Technology (INCET), 2023 4th International Conference for. :1-5 May, 2023
Relation: 2023 4th International Conference for Emerging Technology (INCET)
-
5دورية أكاديمية
المؤلفون: Zhang, Juan, Li, Jing, Wang, Bo, Wang, Jing, Hu, Rui, Shan, Bo, Han, Yupeng, Zhao, Xueli, Zhang, Jun, Zhang, Yanmin, Ta, ShengjunAff1, IDs00380024024145_cor11, Liu, LiwenAff1, IDs00380024024145_cor12
المصدر: Heart and Vessels. :1-10
-
6دورية أكاديمية
المؤلفون: Shan, Bo
المصدر: Communication et organisationOpenAIRE.
Relation: http://journals.openedition.org/communicationorganisation/basictei/2928; http://journals.openedition.org/communicationorganisation/tei/2928
-
7مؤتمر
المؤلفون: Wang, Shan-Bo, Hsu, An-Hsuan, Kao, Chin-Li, Tarng, David, Liang, Chien-Lung, Lin, Kwang-Lung
المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :330-334 May, 2022
Relation: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
-
8كتاب إلكتروني
المؤلفون: Li, Yi-baoAff3, Chen, Hong-taoAff3, Liu, Yu-lanAff3, Li, Ting-huiAff3, Yang, FengAff3, Shen, Shan-boAff4, Hu, Yong-junAff3, Nie, HuiAff3, Li, Zhen-zhouAff3, Li, LiAff3
المساهمون: Wu, Wei, Series EditorAff1, Lin, Jia'en, editorAff2
المصدر: Proceedings of the International Field Exploration and Development Conference 2023 : Volume 1. :621-633
-
9كتاب إلكتروني
المؤلفون: Fan, Le-yuanAff3, Guo, KaiAff3, Sheng, Shan-boAff4, Tai, Un-meiAff3, Cheng, Xiao-dongAff3, Wu, Jia-pengAff3, Li, YangAff3, Ran, Huai-jiangAff3, Li, Tie-zhuAff3
المساهمون: Wu, Wei, Series EditorAff1, Lin, Jia'en, editorAff2
المصدر: Proceedings of the International Field Exploration and Development Conference 2023 : Volume 1. :356-374
-
10كتاب إلكتروني
المؤلفون: Fan, Le-yuanAff3, Wu, Jia-pengAff3, Guo, KaiAff3, Sheng, Shan-boAff4, Cheng, Xiao-dongAff3, Tai, Un-meiAff3, Li, YangAff3, Ran, Huai-jiangAff3, Li, Xi-ningAff3, Li, Yong-guiAff3
المساهمون: Wu, Wei, Series EditorAff1, Lin, Jia'en, editorAff2
المصدر: Proceedings of the International Field Exploration and Development Conference 2023 : Volume 4. :134-152