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1دورية أكاديمية
المؤلفون: Shang, Y, Grip, ET, Modica, A, Skroder, H, Strom, O, Ntanios, F, Gudbjornsdottir, S, Hagstrom, H
المصدر: Diabetes care. 47(6):978-985
مصطلحات موضوعية: Medicin och hälsovetenskap
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2دورية أكاديمية
المؤلفون: Wester, A, Shang, Y, Grip, ET, Matthews, AA, Hagstrom, H
المصدر: Gut. 73(5):835-843
مصطلحات موضوعية: Medicin och hälsovetenskap
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3دورية أكاديمية
المؤلفون: Zhao, SX, Widman, L, Hagstrom, H, Shang, Y
المصدر: Addiction (Abingdon, England). 119(4):706-716
مصطلحات موضوعية: Medicin och hälsovetenskap
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4دورية أكاديمية
المؤلفون: Zaghmi, A, Aybay, E, Jiang, L, Shang, MM, Steinmetz-Spah, J, Wermeling, F, Kogner, P, Korotkova, M, Ostling, P, Jakobsson, PJ, Seashore-Ludlow, B, Larsson, K
المصدر: Molecular oncology. 18(2):317-335
مصطلحات موضوعية: Medicin och hälsovetenskap
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5مؤتمر
المؤلفون: Gungor, Onat, Li, Elvin, Shang, Zhengli, Guo, Yutong, Chen, Jing, Davis, Johnathan, Rosing, Tajana
المصدر: 2024 IEEE International Conference on Cyber Security and Resilience (CSR) Cyber Security and Resilience (CSR), 2024 IEEE International Conference on. :152-158 Sep, 2024
Relation: 2024 IEEE International Conference on Cyber Security and Resilience (CSR)
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6مؤتمر
المؤلفون: Wu, Fenghua, Tang, Wenbing, Zhou, Yuan, Lin, Shang-Wei, Liu, Yang, Ding, Zuohua
المصدر: 2024 WRC Symposium on Advanced Robotics and Automation (WRC SARA) Advanced Robotics and Automation (WRC SARA), 2024 WRC Symposium on. :15-21 Aug, 2024
Relation: 2024 WRC Symposium on Advanced Robotics and Automation (WRC SARA)
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7مؤتمر
المؤلفون: Lu, Sheng, Shang, Liuting, Jung, Sungyong, Zhang, Yichen, Pan, Chenyun
المصدر: 2024 IEEE 67th International Midwest Symposium on Circuits and Systems (MWSCAS) Circuits and Systems (MWSCAS), 2024 IEEE 67th International Midwest Symposium on. :362-366 Aug, 2024
Relation: 2024 IEEE 67th International Midwest Symposium on Circuits and Systems (MWSCAS)
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8مؤتمر
المؤلفون: Tong, Shang, Ouyang, Zhenchao, Hu, Qinglei, Li, Dongyu
المصدر: 2024 IEEE International Conference on Cybernetics and Intelligent Systems (CIS) and IEEE International Conference on Robotics, Automation and Mechatronics (RAM) Cybernetics and Intelligent Systems (CIS) and IEEE International Conference on Robotics, Automation and Mechatronics (RAM), 2024 IEEE International Conference on. :508-513 Aug, 2024
Relation: 2024 IEEE International Conference on Cybernetics and Intelligent Systems (CIS) and IEEE International Conference on Robotics, Automation and Mechatronics (RAM)
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9مؤتمر
المؤلفون: Li, Xiangyu, Shang, Bodong, Wu, Qingqing
المصدر: 2024 IEEE/CIC International Conference on Communications in China (ICCC) Communications in China (ICCC), 2024 IEEE/CIC International Conference on. :1823-1827 Aug, 2024
Relation: 2024 IEEE/CIC International Conference on Communications in China (ICCC)
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10مؤتمرReliability study on thermal cycling of QFP device solder joints based on morphological optimisation
المؤلفون: Liu, Kunpeng, Zhang, Wei, Qu, Chen, Xiang, Gang, Wang, Shang, Tian, Yanhong
المصدر: 2024 25th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2024 25th International Conference on. :01-04 Aug, 2024
Relation: 2024 25th International Conference on Electronic Packaging Technology (ICEPT)