المؤلفون: Wu, C. J., Hsiao, S. T., Wang, J. Y., Lin, W. H., Chang, C. W., Shao, T. L., Tung, C. H., Yu, Doug C. H.

المصدر: 2021 Symposium on VLSI Circuits VLSI Circuits, 2021 Symposium on. :1-2 Jun, 2021

Relation: 2021 Symposium on VLSI Circuits

المؤلفون: Wu, C. J., Hsiao, S. T., Lin, W. H., Chen, H. Y., Shao, T. L., Hsiao, Y. L., Tung, C. H., Yu, Doug C. H.

المصدر: 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2017 IEEE 67th. :1231-1236 May, 2017

Relation: 2017 IEEE 67th Electronic Components and Technology Conference (ECTC)

المؤلفون: Hsu, Y.-C., Shao, T.-L., Chih Chen

المصدر: Proceedings of the 4th International Symposium on Electronic Materials and Packaging, 2002. Electronic materials and packaging Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on. :287-290 2002

Relation: Proceedings of the 4th International Symposium on Electronic Materials and Packaging

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المؤلفون: Liang, S. W., Shao, T. L., Chen, Chih^Aff119, Yeh, Everett C. C., Tu, K. N.

المصدر: Journal of Materials Research. 21(1):137-146

المؤلفون: Chen, Y. H., Shao, T. L., Liu, P. C., Chen, Chih^Aff126, Chou, T.

المصدر: Journal of Materials Research. 20(9):2432-2442

المؤلفون: Shao, T. L., Chen, T. S., Huang, Y. M., Chen, Chih^Aff128

المصدر: Journal of Materials Research. 19(12):3654-3664

المؤلفون: Shao, T. L., Chiu, S. H., Chen, Chih, Yao, D. J., Hsu, C. Y.

المصدر: Journal of Electronic Materials. November 2004 33(11):1350-1354

المؤلفون: Lu, C. M., Shao, T. L., Yang, C. J., Chen, Chih^Aff1

المصدر: Journal of Materials Research. 19(8):2394-2401

المؤلفون: Shao, T. L., Lin, K. C., Chen, Chih

المصدر: Journal of Electronic Materials. November 2003 32(11):1278-1283