المؤلفون: Chai, Tc, Ho, David, Chong, Sc, Sharon Lim, Ps, Hsiao, Hy, Soh, Jacob

المصدر: 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2021 IEEE 23rd. :248-252 Dec, 2021

Relation: 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)

المؤلفون: Hsiao Hsiang-Yao, David Ho Soon Wee, Sharon Lim PS

المصدر: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::8b87856585ee743acdc3d0e3712fe537
https://doi.org/10.1109/eptc56328.2022.10013294

المؤلفون: Lau Boon Long, Chai Tai Chong, Sharon Lim Ps, David Ho

المصدر: 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC).

مصطلحات موضوعية: Materials science, Semiconductor device fabrication, 010401 analytical chemistry, 02 engineering and technology, Substrate (printing), Epoxy, Molding (process), 021001 nanoscience & nanotechnology, medicine.disease_cause, 01 natural sciences, 0104 chemical sciences, law.invention, law, visual_art, Mold, Lamination, visual_art.visual_art_medium, medicine, Process window, Composite material, 0210 nano-technology, Wafer-level packaging

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::3d6c20fc17644459724281d0f88ab451
https://doi.org/10.1109/eptc50525.2020.9315116

المؤلفون: Phua Ts, Serine Soh, Hsiang-Yao Hsiao, Eva Wai, Guan Kian Lau, T. C. Chai, Sharon Lim Ps, S. C. Chong, Boon Long Lau, Wen Wei Seit, Simon Siak Boon Lim, David Ho, Yong Liang Ye, Sharon Lim Sh, Keith Cheng Sing Lim

المصدر: 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC).

مصطلحات موضوعية: Interconnection, business.industry, Computer science, Automotive industry, Electronic packaging, Chip, Manufacturing engineering, visual_art, Electronic component, visual_art.visual_art_medium, Interposer, Data center, business, Wafer-level packaging

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::3451feea83d51fd173b428696924219c
https://doi.org/10.1109/eptc50525.2020.9315155

المؤلفون: Sharon Lim Ps, Ser Choong Chong, Chai Tai Chong, Simon Siak Boon Lim, Hsiao Hsiang-Yao, David Ho Soon Wee

المصدر: 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC).

مصطلحات موضوعية: System in package, Materials science, Fabrication, Application-specific integrated circuit, Process development, business.industry, Interposer, Optoelectronics, Fan-out, High Bandwidth Memory, business, Multi layer

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::452d827cfa77eb53d016d10e0d8b5a9d
https://doi.org/10.1109/eptc.2018.8654423

المؤلفون: David Ho, Daniel Ismael, Chong Ser Choong, Ding Mian Zhi, Vempati Srinivasa Rao, Sharon Lim Ps, Chai Tai Chong, Ye Yong Liang

المصدر: 2017 IEEE 67th Electronic Components and Technology Conference (ECTC).

مصطلحات موضوعية: Engineering, Fabrication, business.industry, 020208 electrical & electronic engineering, Electrical engineering, Fan-out, 020206 networking & telecommunications, 02 engineering and technology, Drop test, Die (integrated circuit), Reliability (semiconductor), Package on package, 0202 electrical engineering, electronic engineering, information engineering, Optoelectronics, Wafer, business, Laser drilling

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::2d5389cb0a433970a6e6ba0f515545fb
https://doi.org/10.1109/ectc.2017.122

المؤلفون: Sharon Lim Ps, Chai Tai Chong, Ye Yong Liang, Ding Mian Zhi, David Ho, Vempati Srinivasa Rao, Chong Ser Choong, Daniel Ismael

المصدر: 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).

مصطلحات موضوعية: 010302 applied physics, Engineering, Fabrication, business.industry, Fine pitch, Fan-out, 02 engineering and technology, 021001 nanoscience & nanotechnology, 01 natural sciences, Drop test, Die (integrated circuit), 0103 physical sciences, Process integration, Electronic engineering, Optoelectronics, Wafer, 0210 nano-technology, business, Wafer-level packaging

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::c12e51fa1357db4943a18b91d386e6a1
https://doi.org/10.1109/ectc.2016.203