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1مؤتمر
المؤلفون: Ian Chin, Shaw Fong Wong, Malatkar, Pramod, Canham, Rick
المصدر: 2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) Electronic Manufacturing Technology Symposium (IEMT), 2008 33rd IEEE/CPMT International. :1-9 Nov, 2008
Relation: 2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT)
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2مؤتمر
المؤلفون: Malatkar, Pramod, Chin, Ian, Chavarria, Jose, Kesavan, Rohini, Shaw Fong Wong
المصدر: 2008 58th Electronic Components and Technology Conference Electronic Components and Technology Conference, 2008. ECTC 2008. 58th. :930-935 May, 2008
Relation: 2008 58th Electronic Components and Technology Conference (ECTC 2008)
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3مؤتمر
المؤلفون: Malatkar, P., Shaw Fong Wong, Pringle, T., Wei Keat Loh
المصدر: 56th Electronic Components and Technology Conference 2006 Electronic Components & Technology Electronic Components and Technology Conference, 2006. Proceedings. 56th. :6 pp. 2006
Relation: 2006 Proceedings. 56th Electronic Components & Technology Conference
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4
المصدر: Circuit World. 49:202-210
مصطلحات موضوعية: Shadow moire, Form factor (design), Materials science, Process (computing), Mechanical engineering, Electrical and Electronic Engineering, Industrial and Manufacturing Engineering, Finite element method
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5
المؤلفون: S. Yagnamurthy, Shaw Fong Wong, Haowen Liu, Steven A. Klein, Haehn Nicholas S, Pramod Malatkar, Shankar Devasenathipathy, Tannaz Harirchian, Chia-Pin Chiu, Seth B. Reynolds
المصدر: 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
مصطلحات موضوعية: Materials science, Interface (computing), 0211 other engineering and technologies, Process (computing), Mechanical engineering, 02 engineering and technology, 021001 nanoscience & nanotechnology, Load cell, Dynamic load testing, law.invention, Stress (mechanics), Hysteresis, Pressure measurement, law, Electronic engineering, Integrated circuit packaging, 0210 nano-technology, 021106 design practice & management
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::767c8d05dbbcf0a02eca0cf2d2255ae0
https://doi.org/10.1109/ectc.2016.328 -
6
المؤلفون: Shaw Fong Wong, Ian Chin, Chua Shiau Chin
المصدر: 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT).
مصطلحات موضوعية: Engineering, Electronic packages, business.industry, Robustness (computer science), Printed circuit layout, Structural engineering, Shock test, Heat sink, business, Reliability engineering, Shock (mechanics)
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::f4feaf68eb6a9b6f143d616dde211c60
https://doi.org/10.1109/iemt.2010.5746699 -
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المؤلفون: Kang Eu Ong, Paramjeet S Gill, Yung Hsiang Lee, Shaw Fong Wong, Kah Kee Tan, Wei Keat Loh
المصدر: 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT).
مصطلحات موضوعية: Surface-mount technology, Reflow soldering, Reliability (semiconductor), Materials science, JEDEC memory standards, Ball grid array, Soldering, Electronic engineering, Mechanical engineering, Coplanarity, Flip chip
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::b367257cdc2b35b903006398a36fd19d
https://doi.org/10.1109/iemt.2010.5746680 -
8
المؤلفون: Pramod Malatkar, Shaw Fong Wong, Rick Canham, Ian Chin
المصدر: 2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT).
مصطلحات موضوعية: Engineering, business.industry, Component (UML), Ball grid array, Rainflow-counting algorithm, Random vibration, Metric (unit), Sensitivity (control systems), Structural engineering, Circuit reliability, business, Reliability (statistics), Reliability engineering
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::37e4cf5c6d34abe68edb30d6882d0e0b
https://doi.org/10.1109/iemt.2008.5507797 -
9
المؤلفون: Zaidi Mohd Ripin, C. Y. Khor, Y. Ooi, Muhammad Khalil Abdullah, Kamarul Arifin Ahmad, Shaw Fong Wong, Mohd Zulkifly Abdullah, M. A. Mujeebu
المصدر: 2008 International Conference on Electronic Materials and Packaging.
مصطلحات موضوعية: Flow visualization, Engineering, Particle image velocimetry, business.industry, Heat transfer, Fluent, Electronics cooling, Mechanical engineering, Microelectronics, Heat transfer coefficient, Computational fluid dynamics, business
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::fa95f83f2acc602ec6b92bfae5ae58be
https://doi.org/10.1109/emap.2008.4784255 -
10
المؤلفون: Ian Chin, J. Chavarria, R. Kesavan, Pramod Malatkar, Shaw Fong Wong
المصدر: 2008 58th Electronic Components and Technology Conference.
مصطلحات موضوعية: Vibration, Engineering, Data point, Mobile internet, business.industry, Ball grid array, Soldering, Embedded system, Component (UML), Structural engineering, business, Failure mode and effects analysis, Shock (mechanics)
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::5ea2f93960fd74b821353eeccf4ba415
https://doi.org/10.1109/ectc.2008.4550087
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